ATS-19F-12-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS32174-ND

Manufacturer Part#:

ATS-19F-12-C2-R0

Price: $ 4.16
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-12-C2-R0 datasheetATS-19F-12-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.78000
10 +: $ 3.67794
25 +: $ 3.47382
50 +: $ 3.26957
100 +: $ 3.06520
250 +: $ 2.86086
500 +: $ 2.65651
1000 +: $ 2.60542
Stock 1000Can Ship Immediately
$ 4.16
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are an integral component of many electronics as they help keep components cool and secure. This product category consists of a variety of heat sinks that are used in a broad array of markets and applications. The ATS-19F-12-C2-R0 is one such thermal-heat sink that is often used in a variety of environments.

The ATS-19F-12-C2-R0 is a rigid heat sink designed for use in extreme temperatures and/or severe vibration environments. It is a robust-profile, two-part, flat-fin structure that is made of extruded or stamped metal. Compatible with a range of metal finishes, the ATS-19F-12-C2-R0 is generally black zinc plated or bright anodized for ultimate UV resistance. This product also features an array of mounting holes and attachment features for easier integration into a system. Moreover, the heat sink is slug-style, meaning sections of it can be purchased in 1 or more specific lengths up to 19 inches.

The ATS-19F-12-C2-R0 thermal-heat-sink can be used in a wide variety of industries, particularly in the telecommunications and computing industries. For example, it can be used in base transceiver stations, customer premises equipment, servers and data centers (e.g. blades). Additionally, finds usage in a variety of consumer products such as medical equipment, flatscreen televisions, HVAC systems and solar converters.

This thermal-heat sink works primarily through conduction. Heat from the electrical components is drawn away by a heat-conductive interface plate that is often held in place by thermal pads. This plate then transfers the heat to the heat-sink fins, which dissipate the heat through convective motion. The ATS-19F-12-C2-R0 is an especially efficient product in this regard as it’s been tested to have the ability to reduce parts up to 75%, while at the same time improving system cooling and longevity.

For further protection against thermal issues, the ATS-19F-12-C2-R0 may be used in conjunction with a cooling-fan assembly. Together the two products help provide variable cooling capability depending on the demands of the overall system. Users also have the ability to mount the heat sink at any angle depending on the needs of the overall application. For instance, the ATS-19F-12-C2-R0 can tilt up to 180° at one end, allowing an unlimited number of end-user configurations. The heat sink can also be used with other cooling solutions, such as liquid cooling, for even more customization.

In conclusion, the ATS-19F-12-C2-R0 thermal-heat-sink is a reliable and efficient product that offers users a variety of design options. It is an effective solution for those who require cooling- solutions in extreme temperatures, or in severe vibration environments. Its two-part slug-style design and large array of compatible finishes lets users customize the product to fit their specific goals. Highly flexible, it works well with a range of other cooling solutions as well.

The specific data is subject to PDF, and the above content is for reference

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