ATS-19F-136-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS32192-ND

Manufacturer Part#:

ATS-19F-136-C2-R0

Price: $ 7.88
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-136-C2-R0 datasheetATS-19F-136-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 7.08750
10 +: $ 6.69627
25 +: $ 6.30252
50 +: $ 5.90877
100 +: $ 5.51477
250 +: $ 5.12089
500 +: $ 5.02240
1000 +: $ 4.92392
Stock 1000Can Ship Immediately
$ 7.88
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.18°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an essential component in any electronic system. Heat is generated by the components in the system and must be efficiently dissipated to maintain the device operating temperature. Heat sinks are components designed to dissipate excessive heat away from a device, thereby improving reliability and performance. The ATS-19F-136-C2-R0 heat sink is a popular choice for a wide range of applications. In this article, we will explore the application field and working principle of the ATS-19F-136-C2-R0.

The ATS-19F-136-C2-R0 is a high-performance heat sink designed for cooling and thermal management in a wide range of applications. It is suitable for components such as CPUs, GPUs, FPGAs, ASICs, and high-power components. The sink offers a large thermal performance ratio with a maximum speed of 150W. It is also highly efficient in low airflow environments and can handle both single and dual processor systems. It is constructed with aluminum fins and is designed to maximize air flow for optimal cooling.

The ATS-19F-136-C2-R0 is designed to work in accordance with the principles of convection, radiation, and conduction. Convection is the transfer of thermal energy between a solid and a liquid or gas, which in this case refers to the movement of air over the heat sink. Heat is transferred from the heat source to the heat-sink fins through the process of conduction. The heat-sink fins then radiate the heat away from the component through the process of radiation. This process is highly effective in quickly dissipating large amounts of heat.

The ATS-19F-136-C2-R0 is an excellent choice for all kinds of applications that require efficient thermal management. The heat sink is compatible with standard mounting equipment and can be easily integrated into existing systems. It is lightweight and compact, making it ideal for applications where space is at a premium. It can also be customized with different sizes and types of fins, allowing it to be used in a wide variety of applications.

The ATS-19F-136-C2-R0 is a reliable and efficient heat sink that can be used in a variety of applications. It is designed to provide optimal thermal management by efficiently dissipating heat away from components. The heat sink is lightweight, compact, and easy to integrate into existing systems. It is an excellent choice for all kinds of applications that require efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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