ATS-19F-15-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS32207-ND

Manufacturer Part#:

ATS-19F-15-C2-R0

Price: $ 4.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-15-C2-R0 datasheetATS-19F-15-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.11390
10 +: $ 4.00239
25 +: $ 3.77975
50 +: $ 3.55748
100 +: $ 3.33509
250 +: $ 3.11275
500 +: $ 2.89041
1000 +: $ 2.83483
Stock 1000Can Ship Immediately
$ 4.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are commonly used in electronics to dissipate heat generated during operation. ATS-19F-15-C2-R0 is a type of heat sink made to meet the requirements of high-power applications where heat build-up needs to be kept to a minimum. This heat sink is designed to provide superior cooling and longevity under extreme conditions. Here, we discuss the application field and working principle of ATS-19F-15-C2-R0.

Application Field

The ATS-19F-15-C2-R0 is designed for use in electronics requiring high-power operation. This includes applications such as communication systems, high-power drones, artificial intelligence systems, power semiconductors, and servers. It can also be used in automotive, aerospace, and industrial settings where thermal management is critical.

The ATS-19F-15-C2-R0 is suitable for use with a variety of components that generate high temperatures, including CPUs, GPUs, and FPGAs. Its superior cooling capability ensures that such components can be operated safely without risk of overheating.

Working Principle

The ATS-19F-15-C2-R0 is a fan-shaped heat sink designed to dissipate heat efficiently. It is constructed from a combination of copper and aluminum to provide superior cooling performance. The aluminum is used for the body, while the copper is used for the fins, providing excellent heat dissipation.

The heat sink has a built-in fan that draws in air from the outside and blows it across the aluminum fins, dissipating the heat created by the components. This increases the rate of heat dissipation, and thus keeps the components cooler. The fan also helps to reduce fan noise, allowing for quieter operation.

The ATS-19F-15-C2-R0 has been designed with an array of features that further improve its performance. These include a high-efficiency heat exchanger, an air deflection plate, a heat dissipation collar, and a fan guard. All these features combine to provide excellent thermal performance and reliability in even the most extreme conditions.

In addition, the ATS-19F-15-C2-R0 has integrated ESD protection to ensure the safety of the components from electrostatic discharge. This protection is provided by a low resistance pass though, which allows any excess static charge to be dissipated safely.

The ATS-19F-15-C2-R0 can be used in a variety of applications and is suitable for most high-power components. Its combination of superior cooling performance, low fan noise, and ESD protection make it an ideal heat sink for use in rugged environments where traditional heat sinks may be less suitable.

The specific data is subject to PDF, and the above content is for reference

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