ATS-19F-150-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS32208-ND

Manufacturer Part#:

ATS-19F-150-C2-R0

Price: $ 4.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X25MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-150-C2-R0 datasheetATS-19F-150-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.83040
10 +: $ 3.72456
25 +: $ 3.51767
50 +: $ 3.31065
100 +: $ 3.10376
250 +: $ 2.89684
500 +: $ 2.68992
1000 +: $ 2.63820
Stock 1000Can Ship Immediately
$ 4.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management within electronics is essential for efficient and reliable operation. Heat sinks are an effective way to dissipate heat away from components, reducing the likelihood of overheating or worse, component damage. The ATS-19F-150-C2-R0 is a robust and versatile aluminum heat sink designed to provide reliable and optimal cooling for a wide range of applications. In this article, we look at the application field and working principle of the ATS-19F-150-C2-R0 heat sink.

Applications of the ATS-19F-150-C2-R0

The ATS-19F-150-C2-R0 heat sink utilizes a unique fin structure and base design to provide excellent cooling performance for a wide range of applications. The heat sink is capable of dissipating between 2 and 15 Watts of thermal energy across its large surface area, and is thus suitable for a variety of electronic components including: CPUs, GPUs, transistors, power amplifiers and more.

The ATS-19F-150-C2-R0 is capable of operating in temperatures up to 105°C, making it perfect for applications where cooler ambient temperatures cannot be accommodated. The heat sink is also designed for applications where vibration or shock may be an issue, making it an ideal choice for applications in transportation, industrial and medical equipment, and other mission-critical systems.

Working Principle

The ATS-19F-150-C2-R0 heat sink consists of a robust aluminum base and a unique fin structure which maximizes heat dissipation. The fins are constructed with a high thermal conductivity material designed to quickly dissipate heat, and provide excellent cooling performance even at high operating temperatures.

The heat sink is designed to optimize the natural convection process, where hot air rises and cooler air replaces it, cycling the efficient removal of thermal energy from the component. The ATS-19F-150-C2-R0 also features an optimized fin profile to maximize the air-flow around the component, providing more efficient cooling over traditional heat sinks.

The ATS-19F-150-C2-R0 is an effective and affordable heat sink solution for a variety of applications. Its robust aluminum construction and efficient fin design provide excellent heat dissipation even at high temperatures, making it an ideal choice for applications where reliability and optimal cooling performance is required.

The specific data is subject to PDF, and the above content is for reference

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