| Allicdata Part #: | ATS-19F-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19F-153-C3-R0 is a thermal heat sink used to manage the heat created by electronic components. Heat sinks are an essential component in virtually any application that uses electronic components, as they help to ensure the longevity of the components and prolong their operational lifetime. The ATS-19F-153-C3-R0 is designed to dissipate heat from the components, ensuring they don\'t suffer from the excessive temperatures that are produced during normal device operations.
The ATS-19F-153-C3-R0 is best suited for applications that require a modest thermal output but still need to be able to dissipate the heat that is created. Some of the most common applications of the ATS-19F-153-C3-R0 include medical and industrial equipment, consumer electronics, and automotive electronics. The heat sink is also suitable for use in other devices, such as laptops, computers, and other electronic devices.
The ATS-19F-153-C3-R0 works by efficiently dissipating and transferring heat away from the components that create it. The heat sink accomplishes this by utilizing a combination of metal fins and a heat pipe. The metal fins are made of a durable material, such as aluminum, and are designed to efficiently transfer heat away from the components. The fins are connected to a heat pipe that rapidly dissipates the heat away from the components and into the ambient air.
The ATS-19F-153-C3-R0 is a relatively small heat sink compared to other similar devices, making it ideal for use in compact and lightweight applications. Its small size and design make it easy to install and maintain, allowing for quick replacement of components should the need arise. The heat sink is also affordable, making it an attractive option for those looking to upgrade or replace their existing heat sink.
The ATS-19F-153-C3-R0\'s performance is maximized through its efficient heat dissipation capabilities and its ability to handle heat generated by a variety of electronic devices. The heat sink is capable of dissipating a large amount of heat, even in a small size. The combination of its copper heat pipe and metal fins makes the ATS-19F-153-C3-R0 highly efficient, and its affordable cost makes it a great choice for those looking to not only reduce their total operational costs, but also get the most out of their existing thermal heat sink.
The specific data is subject to PDF, and the above content is for reference