| Allicdata Part #: | ATS-19F-155-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-155-C3-R0 |
| Price: | $ 4.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-155-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.71322 |
| 30 +: | $ 3.50658 |
| 50 +: | $ 3.30044 |
| 100 +: | $ 3.09412 |
| 250 +: | $ 2.88784 |
| 500 +: | $ 2.68157 |
| 1000 +: | $ 2.63000 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.47°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink is a type of passive heat exchange device that system designers use to transfer heat generated by a power transistor or other electronic component into the surrounding environment. The ATS-19F-155-C3-R0 is a thermal-heat sink, which is designed to be used in power and RF applications, such as telecommunications, power supplies, data centers and other high-power electronics. It is an extruded aluminum heat sink with two lateral fins that allow for increased heat transfer.
The main difference between a thermal-heat sink and other traditional heat sinks is the increased performance of heat transfer. Thermal-heat sinks are optimized to have a greater surface area for contact with the surrounding air, which enables more heat to be dissipated faster. The result is a greatly increased power efficiency compared to other traditional heat sinks.
At the core of the ATS-19F-155-C3-R0 is an extruded aluminum heat sink fin that has been specially designed to optimize the heat dissipation performance. The heat sink fin is C- shaped and designed to maximize surface area for contact with the surrounding air. This allows for greater thermal transfer from the electronic component to the heat sink, resulting in improved power efficiency.
The ATS-19F-155-C3-R0 thermal-heat sink is also equipped with two lateral fins that work in conjunction with the extruded fin to further enhance the heat transfer process. The lateral fins fit against the side of the heat sink fin and they greatly reduce the thermal resistance between the electronic component and the surrounding air by increasing the surface area of contact between the component and the environment.
In addition to improving the power efficiency of the heat sink, the two lateral fins also provide extra mechanical durability to the heat sink itself. The aluminum fins are designed to be stiff and rigid enough to support heavier loads from the electronic component. This helps to ensure that the heat sink can withstand extreme conditions and provide reliable performance over a long period of time.
The ATS-19F-155-C3-R0 thermal-heat sink is designed for use in a variety of applications such as telecoms, power supplies, data centers and other high-power electronics. It is able to dissipate heat more efficiently than traditional heat sinks due to the unique construction of the two lateral fins, which allow for increased heat transfer. This increased performance ensures better power efficiency and greater durability for any system.
The specific data is subject to PDF, and the above content is for reference