| Allicdata Part #: | ATS-19F-158-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-158-C3-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-158-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions are used in a wide variety of fields, ranging from consumer electronics to medical devices. Heat sinks—a type of thermal solution—have become increasingly popular due to their efficient thermal management capabilities. The ATS-19F-158-C3-R0 is a copper heat sink in a nail-like design, that is becoming increasingly common in electronics applications due to its affordability and reliability.
The ATS-19F-158-C3-R0 is a 3-finned rectangular copper heat sink. It measures 1.7 in x 1.1 in x 0.63 in and weighs about 0.22 oz. It is designed with a standard nail-like form, with the fins increasing in size, giving it a unique and aesthetically pleasing look. The unique design of the pins makes it effective at dissipating heat from the surface of the components, helping to maintain a safe temperature.
The ATS-19F-158-C3-R0 is made of high quality copper and features an effective pin design. The thermal conductivity of copper is higher than that of other metals, making it perfect for efficient heat dissipation. The pins are spaced in such a way that they can optimally draw heat away from the component and disperse it into the surrounding air. This helps to keep temperatures low and prevents overheating.
The ATS-19F-158-C3-R0 offers superior performance in thermal solutions due to its exceptional heat dissipation capabilities. This is in part due to its superior material properties such as its effective thermal conductivity, as well as its unique pin design. Its compact size makes it ideal for use in small and compact areas such as circuit boards.
The ATS-19F-158-C3-R0 can be used in a variety of applications, such as computers, laptops, power supplies, LED lighting, and consumer electronics. It is also great for applications such as high-speed switching, gaming consoles, signal processing systems, and automotive electronics. The compact size of the heat sink makes it perfect for these applications, as it will not take up too much space.
The ATS-19F-158-C3-R0 can also be used in industrial and medical applications, as well as various automotive applications. Due to its effectiveness at heat dissipation and its reliable construction, it can be used in environments where other thermal solutions would suffer from too much heat. This makes it great for use in harsh industrial environments, as it can still provide efficient thermal management despite high temperatures.
The ATS-19F-158-C3-R0 is an efficient and reliable copper heat sink that can be used in a variety of applications. Its unique pin design and superior materials make it perfect for dissipating heat and keeping components cool, and it can be used in small and compact spaces where other solutions may not be as effective. Its affordability and reliability make it a great choice for anyone looking for a reliable, efficient heat sink.
The specific data is subject to PDF, and the above content is for reference