ATS-19F-170-C3-R0

Thermal management is a wide field of engineering that deals with the cooling and heating requirements of electronic devices, as well as the management and optimization of a device\'s operating temperature. Heat sinks are a critical component in the thermal management of electronic devices, from computers to communication systems, and not surprisingly, they are made of a variety of materials, and come in an endless selection of sizes and shapes. ATS-19F-170-C3-R0 is a type of heat sink, specifically designed for high heat applications.

ATS-19F-170-C3-R0 is a high-performance, low-cost, dual-sided heat sink with two rows of fixed U-shaped fins and two rows of freely-rotating fin designs. It is made from a durable aluminum alloy with a thermal conductivity of 17 W/m-K and has a coefficient of thermal expansion (CTE) that is better than aluminum. This heat sink measures 170 mm x 125 mm x 40 mm with an overall weight of 400 grams.

This component is an excellent choice for dissipating heat from a wide variety of electronic components, from power supplies and processor packages to amplifier chips and high frequency transistors. It is designed to keep components within their maximum and minimum operating temperatures to enable them to function at peak performance and reliability.

One of the main benefits of ATS-19F-170-C3-R0 is its combination of cost and thermal performance. Its dual-sided design ensures efficient, uniform heat dissipation, while its resistance to corrosion improves longevity and reduces maintenance. Plus, with its two rotating fins, this heat sink can be quickly and easily adjusted to optimize the application’s performance or to meet changing thermal requirements.

The application field of ATS-19F-170-C3-R0 is extensive. It can be used in a wide range of commercial and industrial applications, from server systems to medical imaging systems. The heat sink has multiple mounting options, making it adaptable to any type of installation. It has an optional fan kit to meet high cooling demand configurations. It is also an ideal component for cooling voltage controllers, AC power boards, and DC-DC converters.

In addition to its exceptional performance, ATS-19F-170-C3-R0 also works on a basic principle to provide cooling for a wide variety of applications. A basic principle of thermodynamics states that when two objects of different temperatures are placed in close contact, heat is transferred from the higher temperature object to the lower temperature object. In the case of ATS-19F-170-C3-R0, this is accomplished by the heat sink absorbing heat from the electronic component, which in turn is dissipated away by airflow. This process of heat transfer is further enhanced by the efficient thermal interface material used between the heat sink and the electronic component, resulting in improved thermal performance.

To conclude, ATS-19F-170-C3-R0 is a high-performance, low-cost, dual-sided heat sink with two rows of fixed U-shaped fins and two rows of freely-rotating fin designs. Its combination of cost and thermal performance makes it an excellent choice for cooling electronic components in a wide variety of applications. This heat sink works on the basic principle of thermodynamics, by absorbing heat from electronic components and dissipating it away by airflow.