| Allicdata Part #: | ATS-19F-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems are essential for a number of different types of applications. They are used to control the amount of heat generated by the device or electronic component being used. The ATS-19F-181-C3-R0 is a type of thermal heat sink that offers a much more efficient method of dissipating heat from electronic components and devices.
The ATS-19F-181-C3-R0 is a flat panel thermal heat sink that consists of an array of metal fins arranged in a specific configuration. This particular configuration of fins helps to increase its surface area, which in turn helps to maximize the amount of heat that can be transferred away from the device or component. The fins also have a unique structure that is specifically designed to allow for effective air flow across the surface, thus further increasing the system’s efficiency.
This type of thermal heat sink is designed specifically for use in components or devices that are capable of generating a large amount of heat. It is popular in applications such as semiconductors, power converters, and high power transistors. When properly installed, it can help to maintain the temperature of the component or device at an acceptable level, thus increasing the device’s life span.
In order to understand how the ATS-19F-181-C3-R0 works, it is important to first understand the principles of thermal management systems. All thermal management systems rely on either convection or radiation methods to dissipate heat. Convection relies on air motion and the resulting circulation of air around the device or component in order to move the heat away from it. Radiation, on the other hand, makes use of infrared radiation, which is radiation that has a longer wavelength and is able to penetrate deeper into surfaces.
The ATS-19F-181-C3-R0 is designed to make use of both convection and radiation to dissipate heat. The fins of the heat sink are designed to facilitate effective air flow, thus enabling convection to take place. Additionally, the fins are coated with a special substance that is able to absorb infrared radiation and radiate the absorbed heat away from the device or component. This helps to ensure that the heat is dissipated quickly and efficiently, thereby helping to maintain the temperature of the device or component at an acceptable level.
Overall, the ATS-19F-181-C3-R0 is an excellent choice for applications where thermal management is of utmost importance. Its efficient design helps to quickly and effectively dissipate heat away from the device or component, thus helping to extend its life and improve its performance. Therefore, if you need to manage the temperature of an application, the ATS-19F-181-C3-R0 should be your first choice.
The specific data is subject to PDF, and the above content is for reference