| Allicdata Part #: | ATS-19F-182-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-182-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-182-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.64329 |
| 30 +: | $ 3.44106 |
| 50 +: | $ 3.23870 |
| 100 +: | $ 3.03629 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.63145 |
| 1000 +: | $ 2.58084 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19F-182-C3-R0 is a thermal-heat sinking device designed to be used in components to create a safe and balanced interface between the device and the environment. By dissipating heat in the most efficient manner possible, this product ensures that the device is protected from any thermal overloading that may cause failure or damage. This article will provide an overview of the ATS-19F-182-C3-R0 application fields and working principles, so that any potential user can make an informed decision before proceeding with the device.
The ATS-19F-182-C3-R0 is suitable for use in a wide range of applications, from industrial electronics and health care equipment, to motor systems and television sets. In each case, the device is designed to dissipate any excess heat generated by the device, such as the area around the heat-generating components, stabilise the temperature and reduce noise. Thanks to its temperature and operational stability, this thermal-heat sinking device will also ensure the reliable and safe running of a device.
The ATS-19F-182-C3-R0 features a compact and lightweight design, with a low profile that can be easily fitted into almost any system. The device also has an articulating mount that can be adjusted to fit different components and provide an optimal heat dispersion. Additionally, the device features a wide variety of connection options, including soldered, twist, terminal and terminal screw connections.
In terms of working principle, the ATS-19F-182-C3-R0 uses a natural law known as thermal conductivity to transfer heat from hot surfaces to cooler surfaces. This occurs through a process known as conduction, in which the device absorbs the heat and transfers it away from the heat source and into the surrounding environment. This ensures that the temperature of the system remains in balance, preventing any overheating or damage. The device also includes a fan to ensure the efficient thermal transfer process.
Overall, the ATS-19F-182-C3-R0 is an effective and reliable thermal-heat sinking device designed to ensure the efficient transfer of heat away from devices and into the environment. Thanks to its lightweight design, articulating installation, and wide variety of connection options, the ATS-19F-182-C3-R0 is suitable for a wide range of applications. The device operates using thermal conductivity principles, which ensures that the system temperature remains in balance and prevents any damage or overheating.
The specific data is subject to PDF, and the above content is for reference