ATS-19F-19-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19F-19-C1-R0-ND

Manufacturer Part#:

ATS-19F-19-C1-R0

Price: $ 3.79
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-19-C1-R0 datasheetATS-19F-19-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44673
30 +: $ 3.25542
50 +: $ 3.06394
100 +: $ 2.87242
250 +: $ 2.68093
500 +: $ 2.48943
1000 +: $ 2.44156
Stock 1000Can Ship Immediately
$ 3.79
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.75°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-19F-19-C1-R0 is a thermal-heat sink which is widely used in the electronics industry. It provides an efficient heat dissipation solution to help keep electronics components running cool under normal operating conditions. The thermal-heat sink is used in a wide variety of applications, from consumer-level electronic products to industrial grade systems.

The ATS-19F-19-C1-R0 is based on a new technology known as particlewave dampening (PWD), which is a combination of an elastomeric material and a series of small heat sink fins made out of a special aluminum alloy. This combination provides an efficient, long-life, and cost-effective heat dissipation solution. The thermal-heat sink works by allowing heat to escape quickly due to the air movement which is enabled by the PWD technology.

The working principle of the ATS-19F-19-C1-R0 is based on the ability of the elastomeric material to absorb the heat from the electronics components and then pass it on to the heat sink fins. The fins then disperse the heat into the surrounding air which helps to cool down the components. The process is designed to keep the components running at optimum efficiency and the heat dissipation rate is very high.

The ATS-19F-19-C1-R0 has an excellent thermal performance which makes it ideal for use in many different types of applications. For instance, it is often used in gaming systems, industrial machinery, medical devices, automotive electronics, and even for uses in consumer electronics. The ATS-19F-19-C1-R0 is also used in consumer electronic applications such as cell phone manufacturers and other portable electronic devices.

The ATS-19F-19-C1-R0 is extremely easy to install and maintain. It is designed to be compatible with most other types of heat sinks so it can be integrated quickly and easily into various types of systems. As long as there is plenty of air circulation around the heat sink, it should be able to provide efficient cooling. Additionally, it can easily be replaced if necessary since it is made from a durable material.

Overall, the ATS-19F-19-C1-R0 is an excellent choice for applications that require efficient and reliable heat dissipation solutions. It is easy to install, requires minimal maintenance, and is extremely durable. This makes it an ideal choice for businesses and individuals looking for a reliable and efficient way to keep their electronics components cool.

The specific data is subject to PDF, and the above content is for reference

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