| Allicdata Part #: | ATS-19F-190-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-190-C3-R0 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-190-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.07169 |
| 30 +: | $ 3.84531 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to create air flow to dissipate heat from components of an electronic system. The ATS-19F-190-C3-R0 is a type of thermal-heat sink specifically designed to dissipate heat away from sensitive components. ATS-19F-190-C3-R0 has a variety of applications in both commercial and industrial settings, including computers and industrial automation systems.
Thermal-heat sinks are designed with a specific operating principle in mind. Heat sinks are designed to reduce heat transfer from near-room temperature objects (high temperature components) by absorbing heat from the component and dissipating it through convection to the cooler surrounding air. The ATS-19F-190-C3-R0, specifically, is designed with high thermal conductivity, excellent steady-state thermal performance, and superior mechanical integrity, highlighted by its thin profile.
Due to its high thermal conductivity rating and efficiency, the ATS-19F-190-C3-R0 is ideal for applications where cooling is critical. Its thin profile allows it to be easily integrated into systems while providing efficient heat dissipation, allowing for more compact designs. It can be used in both closed-loop and open-loop cooling systems and is designed to operate in temperature ranges of -40 degrees Celsius to +85 degrees Celsius.
The ATS-19F-190-C3-R0 is designed to dissipate heat from components of an electronic system. It has a high thermal conductivity rating and is able to transfer heat from hotter components to the cooler surrounding air. Its thin profile allows it to be easily integrated into both closed-loop and open-loop cooling systems, while providing effective heat dissipation. Its range of applications in both commercial and industrial settings demonstrates its effectiveness in dissipating heat from sensitive components.
The specific data is subject to PDF, and the above content is for reference