| Allicdata Part #: | ATS-19F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-19F-20-C3-R0 is a thermal component, specifically a heat sink, used in a variety of electronic and electrical applications. It can dissipate heat from components such as power transistors, microprocessors, and other digital circuitry, as well as from components in lamps, motors, heat-generating devices and other industrial equipment.
The ATS-19F-20-C3-R0 is designed with a finned plate construction, which creates a larger surface area than other heat sinks. This increases the amount of heat that can be dissipated. The fins are made of aluminum, which helps to facilitate heat transfer. The heat sink also features a heat spreader plate, which helps direct heat away from the component to be cooled.
There are several ways to attach the ATS-19F-20-C3-R0 heat sink to a component. It can be soldered directly to the component, soldered to a circuit board, or it can be attached using a thermal grease or silicone adhesive. Thermal grease is a special, thermally-conductive material that can be applied between the component and the heat sink in order to increase the rate of heat transfer.
When a component heats up, the heat travels through the fins in the heat sink and is then dissipated into the air. This process of heat transfer occurs in three ways; convection, radiation and conduction. Convection is the process in which heat is carried away by air currents. Radiation is the direct emission of heat from a surface and conduction is the direct transfer of heat through a solid material.
The ATS-19F-20-C3-R0 is designed to operate in temperatures as low as -20C and as high as 80C. This allows it to be used in a range of applications where temperatures fluctuate. In addition, the design of the heat sink allows for maximum performance in high temperature applications.
The ATS-19F-20-C3-R0 is designed with a temperature range of -20C to 80C, allowing it to be used in a variety of applications that require heat dissipation. It is designed with a finned plate construction, which creates a larger surface area than other heat sinks. This increases the amount of heat that can be dissipated. The heat sink also features a heat spreader plate, which helps direct heat away from the component to be cooled. In addition, there are several ways to attach the ATS-19F-20-C3-R0 heat sink to a component, such as soldering, thermal grease, or silicone adhesive. Thermal grease is a special, thermally-conductive material that can be applied between the component and the heat sink in order to increase the rate of heat transfer. The ATS-19F-20-C3-R0 is designed to operate efficiently in order to maximize heat dissipation.
The specific data is subject to PDF, and the above content is for reference