| Allicdata Part #: | ATS-19F-22-C1-R0-ND |
| Manufacturer Part#: |
ATS-19F-22-C1-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-22-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to dissipate heat from electric components, such as CPUs, GPUs, and other chipsets in computers. The ATS-19F-22-C1-R0 is one such heat sink that has a variety of applications to meet the specific needs of different systems. This article will discuss the applications and working principles of this product.
Introduction To ATS-19F-22-C1-R0
The ATS-19F-22-C1-R0 is a heat sink designed to be used with small surface mount components, such as CPUs, GPUs, and other chipsets common in a modern computer. It has a Thermal Resistance of 1.5 C/W, with a low profile height of 15mm and a width of 22mm. This design is ideal for providing effective thermal transfer from small surface mount components to the surrounding environment.
Applications of ATS-19F-22-C1-R0
The ATS-19F-22-C1-R0 is designed for use in various types of computers, ranging from desktop to laptop to tablet PCs. Its low profile design makes it ideal for use in tight spaces, such as the interior of laptop and tablet PCs. Its small size also makes it a good choice for devices that are frequently handled, as it prevents the device from overheating due to contact with the heat sink. In addition, the ATS-19F-22-C1-R0 can be used in desktops and servers, as its large surface area allows it to effectively transfer heat away from more powerful components. Finally, the product also works well in gaming consoles and other places where thermal performance is a necessity.
Working Principle of ATS-19F-22-C1-R0
The ATS-19F-22-C1-R0 uses an advanced heat dissipation technology to ensure effective heat transfer. It is made from anodized aluminum, which is better at dissipating heat than many other materials. This heat sink also makes use of a large number of small heat fins which dissipate heat more effectively, as the fins increase the surface area available for heat to escape from. This heat sink also has a die-cast base which helps increase the contact surface area between the heat sink and the electronic component. This helps reduce thermal resistance and ensures effective heat transfer.
Conclusion
Overall, the ATS-19F-22-C1-R0 is an ideal heat sink for a variety of electronic components, including CPUs, GPUs and others. Its low profile design makes it suitable for use in tight spaces, while its advanced thermal dissipation technology helps it to effectively transfer heat away from the component. It is suitable for use in a variety of computing devices, including laptops, desktop PCs, servers, gaming consoles, and more.
The specific data is subject to PDF, and the above content is for reference