| Allicdata Part #: | ATS-19F-27-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-27-C3-R0 |
| Price: | $ 7.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-27-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.51231 |
| 30 +: | $ 6.15027 |
| 50 +: | $ 5.78857 |
| 100 +: | $ 5.42676 |
| 250 +: | $ 5.06498 |
| 500 +: | $ 4.70319 |
| 1000 +: | $ 4.61275 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-19F-27-C3-R0 Thermal Heat Sink
Heat sinks are designed to absorb and transfer heat away from a hot component. Thermal heat sinks are used for many applications, from electronics cooling to consumer products. The ATS-19F-27-C3-R0 thermal heat sink is an effective solution for managing heat in a range of applications.
The ATS-19F-27-C3-R0 thermal heat sink is made of aluminum and is designed to dissipate up to 27 watts of excess heat. It features a fin area of 9,608 mm2, a base size of156.6 x 156.6 mm, a thermal resistance of 0.7 degrees Celsius per watt, and a total weight of 705 g. It has 27 blades, a 30-mm height, and a recommended operational temperature range of -10 - 150 degrees Celsius.
The ATS-19F-27-C3-R0 thermal heat sink is designed to provide optimum thermal management for a wide variety of applications. It is suitable for use in consumer electronics, telecommunications, automotive, aerospace and military, and medical and power electronics applications. It is also compatible with Intel, AMD, and ALi-PowerPC-equipped electronic devices.
The ATS-19F-27-C3-R0 thermal heat sink works by transferring heat from the component it is attached to. It does this by absorbing the heat into the fins, which increase the surface area to dissipate the heat more quickly. The increased surface area of the fins deflects the heat away from the hot component, allowing for improved thermal management. The heat is then dissipated into the surrounding environment. By transferring the excess heat away from the hot component, the ATS-19F-27-C3-R0 allows the device to operate at its full potential and improves its lifespan.
When selecting a thermal heat sink, it is important to consider the wattage rating, the fin area, and the thermal resistance. It is also important to ensure the sink is compatible with the device it is intended for use with. The ATS-19F-27-C3-R0 thermal heat sink meets these requirements and is suitable for a wide variety of applications.
The ATS-19F-27-C3-R0 thermal heat sink is an effective solution for dissipating a wide range of heat levels. Its aluminum construction, fin area, wattage rating, and thermal resistance make it suitable for a variety of applications. It is compatible with a range of Intel, AMD and ALi-PowerPC-equipped devices and provides optimal thermal management.
The specific data is subject to PDF, and the above content is for reference