| Allicdata Part #: | ATS-19F-37-C2-R0-ND |
| Manufacturer Part#: |
ATS-19F-37-C2-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-37-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions, particularly heat sinks, are an essential component of many industrial and commercial electronic systems. The ATS-19F-37-C2-R0 heat sink is a reliable and efficient thermal solution for high-power semiconductor devices. This article outlines the application field and working principle of the ATS-19F-37-C2-R0.
The ATS-19F-37-C2-R0 heat sink is specifically designed to dissipate the high amounts of heat generated by large power semiconductor devices. These devices require a reliable, durable and efficient thermal solution with a long service life. The ATS-19F-37-C2-R0 is designed to meet these requirements. It is made from cast aluminum, which is highly efficient at dissipating heat, and is rated to handle up to 150 watts at temperatures of up to 250°C.
Due to the high efficiency of the ATS-19F-37-C2-R0, it can be used in a wide variety of applications. It is suitable for use in a wide range of industrial and commercial electronics, including systems that rely on high-powered embedded systems and microcontrollers, including those found in some automotive applications. The ATS-19F-37-C2-R0 is also popular for high-power audio amplifiers, LED lighting projects, and in air conditioners, fans, and other HVAC equipment.
The working principle of the ATS-19F-37-C2-R0 is relatively simple. It is designed to be installed directly onto the device’s heat source, which is typically a large heat sink plate. Heat is then dissipated through the heat sink by convection, effectively cooling the device. The aluminum construction of the ATS-19F-37-C2-R0 ensures that it is highly efficient at conducting the heat away from the device and dissipating it into the surrounding environment.
The ATS-19F-37-C2-R0 also uses a built-in fan for additional cooling. This fan is designed to deliver a steady stream of air directly onto the device’s heat source, allowing for even more efficient cooling. The fan also helps to reduce the risk of the ATS-19F-37-C2-R0 becoming overheated, as the device’s heat source is never allowed to build up too much heat.
The ATS-19F-37-C2-R0 heat sink is an efficient and reliable thermal solution for high-power semiconductor devices. It is designed to handle up to 150 watts at temperatures of up to 250° C, and is suitable for use in a wide range of industrial and commercial electronic systems. The device is made from cast aluminum, which is highly efficient at dissipating heat, and also incorporates a built-in fan for additional cooling. This versatile thermal solution is perfect for a variety of applications, making it a great choice for any project requiring reliable and effective thermal cooling.
The specific data is subject to PDF, and the above content is for reference