| Allicdata Part #: | ATS32291-ND |
| Manufacturer Part#: |
ATS-19F-50-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-50-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-19F-50-C2-R0 Application Field and Working Principle
The ATS-19F-50-C2-R0 is part of the Thermal - Heat Sinks family. It works by providing a direct path for heat to escape from a component. By doing this, it enables the component to remain within a safe operating temperature, thus avoiding heat-related damage and malfunctions.
The ATS-19F-50-C2-R0 is a highly efficient device that is designed to dissipate an impressive amount of heat. It utilizes an extruded aluminum material, which provides excellent thermal transfer and low thermal resistance, as well as a hollow cavity which helps to increase air circulation. This allows the device to dissipate significant amounts of heat quickly and efficiently, while also featuring a low profile design that can be housed within cramped spaces and areas.
The ATS-19F-50-C2-R0 is designed for use in various electronic components, such as processors, GPUs, and semiconductors. It’s often used as a heatsink for cooling high-powered components, as well as power supply circuits, to prevent them from overheating. Additionally, it’s also used as a thermal interface between two heat-producing components (such as CPUs and GPUs), in order to evenly disperse heat generated between the two.
The working principle of the ATS-19F-50-C2-R0 is quite simple. It utilizes the natural principles of convection to transfer the thermal energy generated by a component to the surrounding environment. The ATS-19F-50-C2-R0 achieves this by directing the generated heat away from the component, through the different layers of the thermal sink. This ensures that the heat is efficiently dissipated without any significant accumulation, thus avoiding temperature-related damage and system malfunctions.
The ATS-19F-50-C2-R0 is a high-quality thermal interface material that offers excellent thermal transfer and low thermal resistance. It is an ideal product for use within applications that are likely to generate a significant amount of heat, including computers, gaming consoles, and other electronic devices.
The specific data is subject to PDF, and the above content is for reference