| Allicdata Part #: | ATS-19F-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-19F-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in electronic systems is an important factor in the performance and reliability of the system. Heat sinks are the components most commonly used to achieve thermal management in these systems. ATS-19F-63-C1-R0 heat sink is one of the most commonly used thermal solutions in electronic systems.
The ATS-19F-63-C1-R0 heat sink has a fin density of 30fpi, a base thickness of .375 inches and is designed to fit into a .5 inch diameter hole. It is made of anodized, corrosion-resistant aluminum and is UL approved. It has an overall profile of .500 x .400 inches and a base diameter of .775 inches. The ATS-19F-63-C1-R0 heat sink is designed to operate in temperatures up to 400°F. It is suitable for use in high temperature applications where efficient and reliable heat dissipation is needed.
The working principle of the ATS-19F-63-C1-R0 heat sink is based on the principle of convection. Convection is the transfer of heat by the movement of air or a liquid. In this case, the aluminum fins of the heat sink will absorb heat from the surrounding environment and the natural movement of the air will carry the hot air away from the fins. The fins also help to increase the surface area for greater heat dissipation. The larger the surface area, the more efficient the heat transfer.
The ATS-19F-63-C1-R0 heat sink can be used in a wide variety of electronic systems, including power supplies, motor controllers, circuit boards and other devices where thermal management is important. It is also suitable for use in industrial applications such as telecommunications systems, medical equipment and automotive electronics. Its rugged construction and reliable performance make it an ideal choice for these applications.
The ATS-19F-63-C1-R0 heat sink is an excellent solution for any application in which efficient heat dissipation must be achieved. Its robust construction and reliable performance make it a great choice for both industrial and consumer applications. The ATS-19F-63-C1-R0 heat sink can be installed quickly and easily, allowing users to obtain maximum efficiency and performance from their electronic systems.
The specific data is subject to PDF, and the above content is for reference