| Allicdata Part #: | ATS32309-ND |
| Manufacturer Part#: |
ATS-19F-68-C2-R0 |
| Price: | $ 4.50 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-68-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.08870 |
| 10 +: | $ 3.97908 |
| 25 +: | $ 3.75782 |
| 50 +: | $ 3.53682 |
| 100 +: | $ 3.31582 |
| 250 +: | $ 3.09476 |
| 500 +: | $ 2.87371 |
| 1000 +: | $ 2.81844 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for any electronic device, as it is the key determinant for the longevity and productivity of the device. The ATS-19F-68-C2-R0 thermal-heat sink is an important component for any system and its use must be understood by anyone who develops or operates electronic devices. This article will describe the application field of the ATS-19F-68-C2-R0 thermal-heat sink, its working principle, and the benefits of using it.
Application field
The ATS-19F-68-C2-R0 thermal-heat sink is designed to be used for cooling high-powered components such as transistors, integrated circuits (ICs), and microprocessors. It is often used in high-end computer systems, gaming consoles, and electronics between commercial and industrial grade products. The thermal-heat sink is also used to dissipate heat from other sources such as heaters and lamps.
Working Principle
The ATS-19F-68-C2-R0 thermal-heat sink works by dissipating thermal energy from the component to its immediate environment. The way in which it does this is through a process called convection. When heat energy is applied to the metal fins of the heat sink, the air particles around them become excited and start circulating. This produces a natural flow of air around the fins which dissipates the thermal energy from the device. In addition, the metal fins are designed to absorb some of the heat, and some of the heat is conducted away from the components through the conduction process.
Benefits
The asset of the ATS-19F-68-C2-R0 thermal-heat sink is that it is one of the most effective ways to dissipate heat from components. This is ideal for high-power components that generate a lot of heat. It also has a high thermal impedance, which means that heat is dissipated faster and more efficiently. The metal fins also provide increased surface area for more efficient heat dissipation. Furthermore, the thermal-heat sink is relatively inexpensive to purchase and can be used in a variety of environments.
The ATS-19F-68-C2-R0 thermal-heat sink is a very useful component for any system. It has a wide range of applications, a high thermal impedance, and is relatively inexpensive. This makes it great for cooling any high-power component, such as a computer processor, or for dissipating heat from other sources. Its simple design and easy maintenance also make it a great choice for any project or product.
The specific data is subject to PDF, and the above content is for reference