| Allicdata Part #: | ATS-19F-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-19F-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19F-72-C3-R0 is a type of thermal heat sink specifically designed to dissipate heat away from sensitive components or devices. It is used in a wide variety of applications, including microprocessor cooling, communication system, automation and instrumentation, and industrial electronics. The ATS-19F-72-C3-R0 heat sink is made of high quality aluminum, which is an excellent conductor of heat. It has a natural oxidation-resistant finish, which helps to dissipate heat more quickly. Furthermore, the aluminum is recyclable, making it an environmentally-friendly choice.
The ATS-19F-72-C3-R0 heat sink works by increasing the surface area of the components or devices to which it is attached. This results in increased air circulation which helps to keep the components cooler, thereby reducing the risk of overheating and associated damage. The heat sink also provides a passive cooling solution, so no external power supply is needed for it to operate. Additionally, its sleek design ensures that it fits into virtually any system.
The ATS-19F-72-C3-R0 heat sink is designed to provide superior thermal performance, even under extreme conditions. Its internal structure utilizes a combination of a fin and a plate that is optimized to maximize air flow and heat dissipation. This configuration ensures that the heat sink is able to cool rapidly and effectively, protecting your sensitive components or devices. The fins help to spread the heat more evenly, allowing for a more consistent cooling effect.
The ATS-19F-72-C3-R0 heat sink is a relatively cost effective solution. It does not require any additional components, and its low profile form factor means it can be easily installed into a system without needing to be custom-fitted. Additionally, since it does not consume additional power, it does not add to the overall cost of your system.
In short, the ATS-19F-72-C3-R0 thermal heat sink is an ideal solution for dissipating heat away from sensitive components or devices. It is highly efficient in dissipating heat, and is relatively inexpensive compared to other cooling solutions. Furthermore, its low profile form factor enables it to be integrated into virtually any system with ease. For these reasons, it is an excellent choice for those who need a reliable and effective thermal solution.
The specific data is subject to PDF, and the above content is for reference