ATS-19F-92-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19F-92-C1-R0-ND

Manufacturer Part#:

ATS-19F-92-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-92-C1-R0 datasheetATS-19F-92-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 16.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal-heat sinks provide an efficient way to dissipate heat and transfer it away from sensitive electronic components. The ATS-19F-92-C1-R0 is an aluminum heat sink designed to dissipate heat from an electronic device or component. It is an extruded aluminum heat sink that has been designed with an optimized fin spacing that maximizes its cooling efficiency and ensures that it is suited for high-power components.The primary purpose of this heat sink is to draw heat away from the component it is mounting to and disperse it into the surrounding environment. Heat is drawn away from the component with natural air convection; as air passes over the fins, heat is transferred from the component to the fins, where it is dissipated into the air. This process helps to keep the component within a safe temperature at all times.The ATS-19F-92-C1-R0 features a series of folded, extruded aluminum fins in a variety of shapes and sizes. These fins are designed to increase the surface area for heat to disperse away from the component, making the heat sink significantly more efficient than traditional passive cooling methods. The aluminum material gives the heat sink the necessary strength and durability to ensure a long working life.The ATS-19F-92-C1-R0 is designed to be used in small-scale applications, such as embedded and specialty electronics, and can be used in a variety of mounting configurations. It is suitable for use with standard, low-power components, such as microprocessors, resistors, diodes, and other components. The ATS-19F-92-C1-R0 is a cost-effective solution for thermal management and can be used to improve the performance and reliability of electronic devices.The ATS-19F-92-C1-R0 is the perfect choice for thermal management in applications where longer lifespans and higher reliability are essential. It is a reliable and efficient solution that can provide reliable cooling for a variety of components and help to maintain operational temperatures over a long period of time. It is easy to install and is designed to be compatible with a variety of mounting configurations.The ATS-19F-92-C1-R0 is a high quality thermal-heat sink that is well suited for many different types of application fields where heat needs to be dissipated. It is designed to provide reliable cooling for a variety of components and help to maintain operational temperatures over a long period of time. It is a highly efficient cooling solution that is easy to install and is designed to be compatible with a variety of mounting configurations. The ATS-19F-92-C1-R0 is the perfect choice for thermal management in applications where longer lifespans and higher reliability are essential.

The specific data is subject to PDF, and the above content is for reference

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