ATS-19G-07-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-19G-07-C3-R0-ND

Manufacturer Part#:

ATS-19G-07-C3-R0

Price: $ 3.73
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19G-07-C3-R0 datasheetATS-19G-07-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.38814
30 +: $ 3.29658
50 +: $ 3.11346
100 +: $ 2.93026
250 +: $ 2.74713
500 +: $ 2.65555
1000 +: $ 2.38083
Stock 1000Can Ship Immediately
$ 3.73
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.09°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

<div class="thermo-heat-sinks"><h2>ATS-19G-07-C3-R0 Application Field and Working Principles</h2><p>The ATS-19G-07-C3-R0 is a type of heat sink that is most commonly used in power and thermal management applications, such as CPU cooling, voltage regulation, over-temperature protection, and other temperature control functions.</p><p>Heat sinks are devices used to absorb, store, and dissipate heat from electrical components or thermal components, such as processors or transistors. Heat sinks help to keep electronic components and circuits at a relatively low temperature, allowing components to operate at a much higher temperature than they could in the absence of a heat sink.</p><p>The ATS-19G-07-C3-R0 heat sink is a unique design that is constructed from extruded aluminum. This design helps to quickly and evenly dissipate heat away from the component it is attached to. The ATS-19G-07-C3-R0 also contains a variety of fins that efficiently increase the rate of heat dissipation from the device.</p><p>The ATS-19G-07-C3-R0 has a large amount of surface area, which helps to maximize the airflow and contact between the component and heat sink. This allows for more efficient cooling, as more surface area is in contact with the component and heat sink.</p><p>The ATS-19G-07-C3-R0 is also highly efficient in terms of its thermal resistance. This helps to minimize the amount of power needed to cool the component, as the heat sink dissipates heat away from the device faster and more efficiently.</p><p>The ATS-19G-07-C3-R0 is also designed to be lightweight and easy to install. This makes it a great choice for applications where space is a concern, or where the heat sink needs to be easily replaced.</p><p>The ATS-19G-07-C3-R0 is a powerful and reliable heat sink, designed to be used in power and thermal management applications. Its unique design helps to quickly and effectively dissipate heat from the component, while also providing high efficiency, lightweight construction, and easy installation.</p></div>

The specific data is subject to PDF, and the above content is for reference

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