| Allicdata Part #: | ATS-19G-107-C1-R1-ND |
| Manufacturer Part#: |
ATS-19G-107-C1-R1 |
| Price: | $ 4.38 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19G-107-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.94443 |
| 30 +: | $ 3.72519 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in electronic systems is becoming increasingly important in in modern applications. As the complexity of devices continues to increase, devices must dissipate more heat in order to function properly. Heat sinks are designed to absorb this heat and dissipate it away from the system, helping to maintain reliable operation of the device. ATS-19G-107-C1-R1 is a type of heat sink specifically designed to provide efficient heat dissipation and reliability in a wide range of applications.
ATS-19G-107-C1-R1 is a high-powered thermal solution, offering advanced performance and reliability in its small form-factor. The thermal solution is made of a single-piece aluminium design, which ensures efficient heat dissipation while at the same time providing a lightweight solution. This makes the thermal solution ideal for low-profile, lightweight electronics. Additionally, the thermal solution is available in both a Z-axis configuration (top-to-bottom) and an X-axis configuration (side-to-side), allowing for an easy installation in different sized enclosures.
In terms of performance, the ATS-19G-107-C1-R1 offers excellent thermal transfer capabilities. The thermal solution is designed to help dissipate heat away from the source quickly and efficiently. It features an extended heat fin design, which increases the surface area of the heat sink, allowing for greater heat transfer rates. Additionally, the thermal solution offers a low-profile design, which ensures that it does not protrude from the device, helping to maintain the overall aesthetics of the product.
The ATS-19G-107-C1-R1 is also designed to provide reliable performance over time. It is constructed using high-quality materials and is designed to withstand the operating environment of industrial applications including extreme temperatures. The thermal solution has an excellent heat dissipation rate, ensuring that the device remains cool and reliable, even under the most challenging conditions. Additionally, the thermal solution is designed with an easy installation process, allowing for a quick and easy installation in a variety of applications.
The ATS-19G-107-C1-R1 is suitable for a wide range of applications, including industrial, medical, and automotive. It is suitable for use in a variety of electronic systems that require efficient and reliable thermal management. In industrial applications, the thermal solution can be used in the production of industrial computers, such as programmable logic controllers and machine vision systems. In medical applications, the thermal solution can be used to provide reliable temperature control of electronic medical equipment. In automotive applications, the thermal solution can be used to ensure that electronic components, such as sensors and actuators, are not damaged by overheating.
In conclusion, the ATS-19G-107-C1-R1 is an advanced thermal solution that offers reliable performance and efficient heat dissipation in a wide range of applications. With its high-powered performance and reliable design, the thermal solution is an excellent choice for a variety of applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference