ATS-19G-116-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-19G-116-C3-R0-ND

Manufacturer Part#:

ATS-19G-116-C3-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19G-116-C3-R0 datasheetATS-19G-116-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.26°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-19G-116-C3-R0 is a kind of thermal - heat sinks, which has a wide variety of application fields and working principles.

Application Fields

The ATS-19G-116-C3-R0 is designed to act as a heat dissipation device used in thermal management applications. It is mainly used in areas such as consumer electronics, computers, communications, automotive, medical, and various instrumentation equipment.

Consumer electronics includes products such as mobile phones, tablets, digital cameras, digital video cameras, digital recorders, digital video players, game consoles, portable media players, digital audio players, and other consumer electronic devices. The AT-19G-116-C3-R0 can efficiently dissipate the heat generated from these devices while they are in operation.

The ATS-19G-116-C3-R0 also finds extensive use in computers. It can help maintain a stable operating temperature of the processor and memory chips by dissipating the heat generated during operation. ATS-19G-116-C3-R0 is also used in laptops to dissipate the heat generated while the laptop is being used for extended periods of time.

The ATS-19G-116-C3-R0 is also used in communications systems, such as radio frequency transmitters and receivers, to dissipate the heat generated by these systems when they are in use. This heat sink is also suited for use in automotive electronics, such as engine control units, to help maintain the operating temperature of these components.

The ATS-19G-116-C3-R0 is also used in medical equipment such as CAT scanners, MRI machines, and ultrasound machines to dissipate the heat generated when these devices are in use. Additionally, this heat sink is used in instrumentation equipment such as analyzers, testers, and other scientific equipment to maintain the temperature of the electronic components.

Working Principle

The basic principle on which the ATS-19G-116-C3-R0 operates is heat conduction. Heat is conducted from the component to the surface of the heat sink where it is dissipated. The heat sink surface is usually formed from various metal alloys or plastic, depending on the application. The surface of the heat sink is designed to maximize heat dissipation.

The ATS-19G-116-C3-R0 features special thermal adhesive tape that allows it to be attached to the surface of the component. This ensures a secure connection between the heat sink and the component, which increases the heat conduction. The adhesive is resistant to temperatures up to 120°C, making it suitable for high power applications. Additionally, the thermal adhesive tape helps to reduce the thermal resistance between the component and the heat sink, resulting in increased efficiency.

The ATS-19G-116-C3-R0 is also fitted with a fan that helps to dissipate the heat. The fan is usually connected to the heat sink via a fan connector. The fan speeds up the heat dissipation process by creating airflow over the surface of the heat sink. This airflow helps to reduce the temperature of the component, resulting in improved performance.

In summary, the ATS-19G-116-C3-R0 is a kind of thermal - heat sinks. It is used in a variety of electronic applications, such as consumer electronics, computers, communications, and instrumentation. This heat sink utilizes the principles of heat conduction and convection to efficiently dissipate the heat generated by the components, ensuring that they maintain a stable operating temperature.

The specific data is subject to PDF, and the above content is for reference

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