| Allicdata Part #: | ATS-19G-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-19G-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19G-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential part of thermal management and have become an important tool for controlling temperatures in electronic devices. They are used not only in computers but many other electronic products such as LED lamps, solar panels and medical equipment. ATS-19G-117-C1-R0 is an example of a heat sink designed for high-power applications.
The ATS-19G-117-C1-R0 is a highly efficient heat sink with an extruded aluminum design and high thermal conductivity. The fin shape features a curved extrusion profile, which reduces the thermal resistance of the heat sink and increases air flow to the heat fins. The heat sink also has a built-in fan for additional cooling. The fan is also designed to reduce wind resistance and to ensure efficient air flow. The fan is thermally controlled, so it can be adjusted based on the temperature of the device.
The ATS-19G-117-C1-R0 can be used in a variety of applications including high-power processors, switching power supplies, data centers, servers and other types of cooling systems. It is especially suitable for applications such as gaming, 3D printing and AI development, which require high levels of heat dissipation to ensure optimal performance. The ATS-19G-117-C1-R0 has a wide range of configurations, so it can be customized to meet the specific needs of the application.
The ATS-19G-117-C1-R0 functions by transferring heat away from the processor or other components. Heat generated is transferred from the device to the heat fins via conduction. The fins are then cooled by air circulation, which is created by a fan. The fan is controlled according to the temperature, so it can be adjusted to provide optimal cooling.
The ATS-19G-117-C1-R0 is a highly efficient heat sink designed for a variety of thermal management solutions. It is an effective way to manage temperatures in high-power applications, allowing for maximum performance and reliability. With its fan and curved extrusion profile, it provides efficient cooling while also reducing wind resistance. The ATS-19G-117-C1-R0 is an excellent choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference