ATS-19G-126-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19G-126-C1-R0-ND

Manufacturer Part#:

ATS-19G-126-C1-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19G-126-C1-R0 datasheetATS-19G-126-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management products must be chosen carefully in order to ensure an efficient and long-lasting application. The ATS-19G-126-C1-R0 is a new high thermal performance heat sink offering reliable thermal transfer. It is highly efficient, reliable, and easy to install. With its high quality construction, it is the perfect choice for a variety of thermal management applications.

The ATS-19G-126-C1-R0 is suitable for a range of applications, including those which require high thermal performance, such as embedded heat sinks for CPUs, applications that require existing space management, or where the maximum thermal performance is a priority. This product is also ideal for applications in communication and electronic engineering, which require a certain degree of thermoelectric isolation.

The ATS-19G-126-C1-R0 uses Clip-on High-performance Heat Sink (CHPHS) technology, which is designed to provide efficient heat dissipation in high temperatures and demanding environments. The CHPHS technology offers rapid thermal transfer between the heat source and the heat sink, allowing the components to operate steadily and efficiently. It also works to reduce thermal overloading due to ambient temperature changes.

The ATS-19G-126-C1-R0 is composed of a high-performance sheet metal substrate and a variety of thermal-conductive frames. It is designed to have low thermal impedance and high thermal resistance. The use of high-performance frames ensures that the heat sink offers exceptional thermal performance at elevated temperatures with minimal soldering. Moreover, the advanced thermal design allows for a rapid decrease in the temperature of surrounding components when subjected to extreme temperature variations.

The ATS-19G-126-C1-R0 works using a combination of both convection and conduction. It employs a convection cooling technique that heats up air surrounding the heat sink and uses fans to dissipate the heat. This process employed by the ATS-19G-126-C1-R0 offers greater thermal efficiency and thermal stability.

In addition, the ATS-19G-126-C1-R0 also features a thermal interface material (TIM) which effectively improves the thermal performance of the heat sink. The TIM reduces thermal resistance between the heat sink and source by filling the microscopic rough edges and providing greater thermal conductivity. This helps in the surface-to-surface heat dissipation from the heat source to the heat sink.

The ATS-19G-126-C1-R0 is designed to offer superior heat transfer in a range of applications. It features a durable and reliable construction with a variety of high-quality materials and a unique set of design parameters to provide superior thermal performance. Furthermore, the ATS-19G-126-C1-R0 is easy to install, enabling quick and simple thermal management without the need for complex installation.

The ATS-19G-126-C1-R0 promises to be a reliable and versatile thermal management solution suitable for a range of applications. Its thermal design ensures a rapid and efficient transfer of heat from the heat source to the heat sink while its durable and reliable construction makes it the perfect choice for a variety of thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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