ATS-19G-134-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS32388-ND

Manufacturer Part#:

ATS-19G-134-C2-R0

Price: $ 7.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X15MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19G-134-C2-R0 datasheetATS-19G-134-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.58350
10 +: $ 6.40773
25 +: $ 6.05203
50 +: $ 5.69596
100 +: $ 5.34001
250 +: $ 4.98401
500 +: $ 4.62801
1000 +: $ 4.53900
Stock 1000Can Ship Immediately
$ 7.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an incredibly important part of modern life, from consumer electronics to large industrial process control systems. Components like the ATS-19G-134-C2-R0 play a vital role in keeping critical systems functioning at optimal levels and protecting components from damage due to overheating. This article will discuss the role of ATS-19G thermal-heat sinks, as well as their applications and working principles.

ATS-19G thermal-heat sinks are designed to dissipate heat from components that generate large amounts of it while in operation. By spreading and dissipating the heat away from critical components, ATS-19G sinks help reduce component temperatures, thereby helping to improve system performance and increase system reliability. Additionally, these thermal-heat sinks allow designers to meet specific temperature requirements, such as those specified by component manufacturers, to ensure components are not exposed to excess heat.

The ATS-19G thermal-heat sink is made up of a base, heat spreader fins, and fan. The base of the sink is made from a heat-resistant material, such as aluminum. The heat spreader fins are then placed on top of the base, creating an open network of channels. The heat is then spread throughout the heat sink via the fan, which is typically designed to generate an airflow of about 300CFM. This design helps to ensure that the heat is drawn away from the components and then dissipated out of the system.

ATS-19G thermal-heat sinks can be used in a variety of different applications, including printed circuit board (PCB) and integrated circuit cooling in consumer electronics, as well as industrial systems and processing units. Additionally, they can also be used as thermal breaks for components, helping to dissipate heat away from surfaces and protect them from damaging temperatures. These sinks can also be used to help reduce system noise levels, as the fan causes a cooling effect that helps to reduce the overall temperature.

The working principle of the ATS-19G thermal-heat sink is relatively simple. Heat is drawn away from the components and then spread outward across the heat sink using airflow created by the fan. The heat then passes through the open channels created by the heat spreader fins before dissipating out of the system due to the combination of convection and radiation. The fan is designed to create a sufficient amount of airflow to ensure that the heat is dissipated quickly and efficiently.

In conclusion, ATS-19G thermal-heat sinks are a versatile and effective solution for keeping components cool and protected from overheating. The sink consists of a strong base, heat spreader fins, and fan, and the working principle is based on convection and radiation. These sinks are used in a variety of different applications, from consumer electronics to industrial systems, helping to improve performance and reliability of systems.

The specific data is subject to PDF, and the above content is for reference

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