ATS-19G-140-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.55°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThermal - Heat Sinks are a group of specialized products that are designed to manage and dissipate heat from electronic components. The ATS-19G-140-C3-R0 is one such product and its application field and working principle will be discussed in this article.Backgroundheat sinks are essential components when it comes to many modern electronics. As most electronics, particularly computers, generate significant amounts of heat in order to operate, a heat sink is essential to prevent the components from overheating, either through air heat transfer or liquid cooling. These heat sinks can come in a variety of designs, shapes, and materials to suit their intended application.ATS-19G-140-C3-R0 Heat SinkThe ATS-19G-140-C3-R0 heat sink is a specialized product that uses a combination of aluminum and copper to dissipate heat generated by electronic components. The design of the heat sink is based on a finned profile with several fins, allowing for increased surface area for better heat transfer characteristics. Additionally, the ATS-19G-140-C3-R0 also utilizes the micro-structures due to its grooved design to increase thermal transfer rates.Application FieldThe ATS-19G-140-C3-R0 can be used in a variety of high heat transfer applications such as LED lighting, power supplies, cooling systems, and industrial electronics. Due to its finned profile and grooved design, the heat sink has excellent heat dissipation capabilities and is suitable for applications that require fast thermal transfer rates. Additionally, the ATS-19G-140-C3-R0 is available in both low profile and standard profile design to better match the high heat transfer requirements of larger applications.Working PrincipleThe ATS-19G-140-C3-R0 operates on the principle of heat transfer via convection. When the heat sink is exposed to a hot environment, the fins act as conductors, allowing the heat to pass through them and spread over the heat sink’s surface. The grooved design also creates micro-channels, increasing the surface area and allowing more heat to be absorbed. As the heat is absorbed and passes through the heat sink’s fins, it is then transferred to the surrounding air, thus cooling the electronic components.ConclusionThe ATS-19G-140-C3-R0 is a specialized heat sink designed to quickly dissipate heat generated by electronic components. It is designed with aluminum and copper material, finned profiles, and grooved designs to increase thermal efficiency. Additionally, the ATS-19G-140-C3-R0 is suitable for high heat transfer applications like LED lighting, power supplies, cooling systems, and industrial electronics. The heat sink operates on the principle of heat transfer via convection, allowing it to quickly and efficiently dissipate heat away from the components.

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