ATS-19G-159-C1-R0

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Thermal - Heat Sinks are used in a wide range of applications, from computer and CPU cooling to the cooling of electrical and electronic systems. ATS-19G-159-C1-R0 is a thermal-heat sink from ATS that is specifically designed to provide optimum thermal performance in harsh environments. This article will discuss the application field and working principle for ATS-19G-159-C1-R0.

Application Field

The ATS-19G-159-C1-R0 is designed to provide maximum thermal management in application fields such as telecom, industrial automation, medical equipment, and audio amplifiers. This thermal-heat sink is ideal for applications that need high-performance yet dependable thermal management, as the sink features a thermal resistance of 0.29K/W and maximum continuous temperature of up to 105°C. It is a superior choice for applications that require a combination of high performance and reliable operations in harsh environments.

Features

The ATS-19G-159-C1-R0 offers several features to ensure reliable and efficient thermal management. It features a thermally efficient, aluminum/zinc base that transfers heat away from heat-loaded components without the need for heavy and complex heat pipes and fans. The sink also features press-fit fins that are highly effective in dissipating heat away from components. Additionally, the sink uses a patented interface between component and fin that efficiently transfers heat away from the component without the need for additional clips or fasteners.

Compatibility

The ATS-19G-159-C1-R0 is designed for compatibility with most standard and advanced components, including TO-220, TO-247, and TO-264 package types. These compatibility features make the sink an ideal choice for any application requiring densely populated boards with stiff thermal heatsink constraints.

Working Principle

The ATS-19G-159-C1-R0 thermal-heat sink utilizes a thermally efficient base and press-fit fin design to effectively transfer heat away from components. The sink absorbs and disperses heat from the component via metal layers in the aluminum/zinc base. This heat is then transferred away from the component through the press-fit fins. The fins allow a greater surface area to move more heat away from the component, while the patented interface between the fin and the component ensures optimal transfer of heat away from the component.

Conclusion

The ATS-19G-159-C1-R0 thermal-heat sink is a reliable and efficient thermal management solution for a variety of applications. With its thermally efficient base, press-fit fins, and patented interface between component and fin, this sink offers superior thermal performance that allows it to safely and effectively manage heat in harsh environments. The compatibility features of the ATS-19G-159-C1-R0 also add further value, as it is designed for compatibility with several package types. Overall, the ATS-19G-159-C1-R0 is the ideal thermal-heat sink solution for applications requiring superior thermal performance in harsh environments.

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