| Allicdata Part #: | ATS32425-ND |
| Manufacturer Part#: |
ATS-19G-168-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19G-168-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.01°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Application Field and Working Principle of ATS-19G-168-C2-R0
The ATS-19G-168-C2-R0 is a heat sink specifically designed for thermal management. The device is designed to efficiently absorb excessive heat generated from electronic components, and dissipate that heat away from the component, keeping it cool.
Description
The ATS-19G-168-C2-R0 is a high-performance heat sink designed to disperse thermal energy away from hot components. It is constructed of aluminum with a die-cast shape, making it easy to mount onto electronic components. It is designed as a two-sided heat sink to maximize its heat absorbing capabilities. The heat sink utilizes a combination of vertical fins and heat spreaders for effective heat transfer, and each fin has an integral louvered area for improved air flow.
Uses of ATS-19G-168-C2-R0
The ATS-19G-168-C2-R0 is an ideal choice for applications that generate significant amounts of heat but must remain cool in order to perform properly. It can be used in a variety of electronic applications such as power amplifiers, digital-to-analog converters, and microprocessors, as well as in industrial control and automation systems that require thermal management solutions. Additionally, the heat sink is designed to be relatively lightweight and easy to mount, making it an ideal choice for mobile applications as well.
Installation & Setup
The ATS-19G-168-C2-R0 comes with an installation package that includes a mounting bracket and bolts. Additionally, each heat sink includes thermal compound, which should be placed between the heat sink and the component for improved heat transfer. To install the device, it must first be mounted onto the component, and then securely fastened to the component using the supplied bolts. After installation, the device should be tested to ensure proper performance.
Working Principle
The ATS-19G-168-C2-R0 works by absorbing and dissipating heat away from the component. The device features a combination of heat spreaders and vertical fins, which provide an increased surface area for heat transfer. The heat is absorbed through the fins and then dissipated away via air flow. By dissipating the heat away from the component, the device is able to extend the lifetime of the component.
Applications
The ATS-19G-168-C2-R0 can be used in a wide variety of applications that require effective thermal management solutions. Its lightweight design and easy mounting make it an ideal choice for mobile devices, and its efficient heat absorption and dissipation make it an excellent choice for controlling temperatures in electronic components. Additionally, the device is ideal for industrial control and automation systems that require effective thermal management solutions.
The specific data is subject to PDF, and the above content is for reference