ATS-19G-170-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.07°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-19G-170-C2-R0 Thermal - Heat Sinks Application and Working Principle

ATS-19G-170-C2-R0 thermal - heat sinks are used to help dissipate heat from high-powered electrical and electronic devices. They are often used in the aerospace, automotive, medical, and consumer electronics industries, as well as for other applications where efficient heat management is critical. Heat sinks are available in many shapes and sizes and have several different materials and designs. This article will look at the application field and working principle for ATS-19G-170-C2-R0 thermal - heat sinks.

Application Field

A key application field for ATS-19G-170-C2-R0 thermal - heat sinks is the automotive industry. Heat sinks are used to cool rapidly changing hot electronics components, such as those found in the engine or hybrid drive systems. The use of these sinks helps to reduce the overall size and weight of the vehicle, while still providing the reliable cooling required. Heat sinks are also used in a variety of consumer electronic products, ranging from cell phones and media players to gaming consoles and laptops.Medical devices are also a common application for ATS-19G-170-C2-R0 thermal - heat sinks. Heat sinks help to control the temperature of sensitive components, ensuring that they do not overheat and cause damage or malfunctions. Heat sinks are widely used in MRI and X-ray machines, as well as other medical equipment which must continue to function even in extreme conditions.

Working Principle

The basic principle behind the operation of ATS-19G-170-C2-R0 thermal - heat sinks is that of thermodynamics. Thermal radiation is emitted from a hot surface, and this radiation is transferred to the cooler environment outside the device, which then dissipates the heat. Heat sinks typically consist of several metal fins which are used to increase the surface area of the sink, thus enabling faster radiation of the heat.The fins and base of the heat sink typically consist of a heat-dissipating material such as aluminum. Heat is usually transferred from the device to the sink by means of conduction or convection, and this causes the metal to absorb and dissipate the heat. As the heat is dissipated the air around the sink cools, which helps further lower the temperature.

Conclusion

ATS-19G-170-C2-R0 thermal - heat sinks are an efficient and cost-effective way to dissipate heat from high-powered electrical and electronic components. Heat sinks are used in a variety of application fields and work by transferring thermal radiation emitted from the device into the cooler environment. The use of heat sinks helps to reduce the size and weight of the device, while ensuring that the components are kept at the ideal temperature.

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