ATS-19G-171-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical to ensure the proper functioning of electrical and electronic systems, components, and assemblies. Heat sinks are a type of passive heat exchanger that cools by dissipating heat to the surrounding air. They come in a variety of shapes and sizes, from large aluminum and copper blocks to small thermal tape, adhesive, and even liquid heatsinks. Heat sinks offer a reliable and cost-effective solution for managing high-heat loads or for cooling densely-packed components. ATS-19G-171-C1-R0 is a specially designed ultra-thin heat sink, bringing an excellent thermal performance to micro- and mini-sized applications.

The ATS-19G-171-C1-R0 thermal solution is best for applications with a maximum power rating of 5 Watts, where size and weight must be kept to a minimum. The profile of this heat sink is extremely small, allowing it to be used effectively in miniature components for portable electronic devices. This heat sink also has excellent thermal and mechanical performance, and it is made from reliable copper material with a gold plating for superior durability. It is RoHS certified in accordance with current regulations, and its combination of small size and good thermal performance makes it suitable for numerous miniature applications.

The main components of ATS-19G-171-C1-R0 include an anodized aluminum body, consisting of two separate parts, a cooling fin array, and spring clips for mounting to the back of the device. The fin arrangement is optimized for improved heat exchange, and the body is designed for efficient heat transfer. Its 0.17 mm thin profile also enables the cooling fans to be mounted onto the back of the component, allowing for more efficient cooling and higher power dissipation. The spring clips are designed to provide a secure mounting, and they are also resistant to corrosion.

In terms of working principle, ATS-19G-171-C1-R0 acts as a heat exchanger, aiding in heat removal from the device being cooled. It works by effectively transferring the heat created by the component, from the device to its fins, which in turn absorb the heat and dissipate it to the environment. Thanks to its excellent thermal performance, power dissipation is maximized, resulting in more efficient cooling. As well, its ultra-thin profile maximizes the airflow between the cooling fins, allowing for greater cooling efficiency.

ATS-19G-171-C1-R0 is an excellent choice as a thin and lightweight thermal solution, and its combination of small size, good thermal performance, and durable construction makes it suitable for numerous miniature applications. Its anodized aluminum body, optimized fin arrangement, and corrosion-resistant spring clips work together to ensure that this heat sink is able to effectively dissipate heat and maximize power dissipation. This combination of features makes ATS-19G-171-C1-R0 an ideal thermal solution for a wide range of micro- and mini-sized applications.

The specific data is subject to PDF, and the above content is for reference