| Allicdata Part #: | ATS-19G-174-C3-R0-ND |
| Manufacturer Part#: |
ATS-19G-174-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19G-174-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.94953 |
| 250 +: | $ 2.75290 |
| 500 +: | $ 2.55626 |
| 1000 +: | $ 2.50711 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19G-174-C3-R0 is a type of thermal-heat sink, and is used to keep components within a device cool. It does this by dissipating the heat that is generated by the component within the device, keeping the component from overheating and potentially becoming damaged. The ATS-19G-174-C3-R0 can be used in a variety of applications, including servers, networking equipment, military and aerospace applications, and even medical imaging equipment.
The ATS-19G-174-C3-R0 operates on the principle of heat dissipation. Heat is transferred from the component to the heat sink by various methods, such as convection, radiation, and conduction. Convection is the process of heat transferring from the component to the sink by the motion of molecules in matter. Radiation is when the heat from the source is directly transferred to the sink by electromagnetic waves. Lastly, conduction is the process of heat traveling from one substance to another through direct contact.
The ATS-19G-174-C3-R0 is manufactured using aluminum with a thin layer of copper coating to improve dissipation performance. The design of the device features a large, flat surface area in the center for heat dissipation. It also has fins along the bottom and two sides, which further helps to increase the surface area that can be used to dissipate heat. Additionally, the device is designed to be easily mounted to a number of different surfaces, as well as having a number of holes or slots for fixing the device in place.
The ATS-19G-174-C3-R0 has an advertised thermal resistance of 0.9°C/Watt, which is considered to be very good for this type of product. This means that it can dissipate heat very efficiently and can keep the component temperature low even under high use. The thermal resistance rating can change depending on the environment that the device is used in, but this is usually only a minor difference and can be accounted for when considering the product.
The ATS-19G-174-C3-R0 is an excellent choice for applications where heat dissipation is required. It is durable, efficient, and can be used in a variety of different applications. Additionally, it does not require a large amount of space for installation, making it a great option for devices and applications that require a minimal amount of space for cooling. As such, the ATS-19G-174-C3-R0 is a great choice for anyone looking for an effective thermal-heat sink that is easy to install and use.
The specific data is subject to PDF, and the above content is for reference