ATS-19G-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19G-20-C1-R0-ND

Manufacturer Part#:

ATS-19G-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19G-20-C1-R0 datasheetATS-19G-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-19G-20-C1-R0 application field and working principle

ATS-19G-20-C1-R0 is a heat sink designed for use in various applications. It is made of aluminum or copper, and utilizes a special design that allows for high levels of heat dissipation. The device works by dissipating heat from the system as it is powered on. It does this by using the latent heat of vaporization of a liquid coolant that is held in a closed-loop system. The liquid coolant is pumped through the heat sink and is then evaporated through the heat sink, where it transfers its heat energy to the cooling system.

The cooling system is typically mounted to the side or top of the heat sink, and uses fan-generated air to cool the device. As the air passes through the fins of the heat sink, it extracts heat from the system and distributes it. The heat transfered from the liquid coolant to the air is then further dissipated into the atmosphere where it cools. This type of heat sink is typically used in high-powered electrical and electronic systems, including PC and server computer systems, industrial automation systems, and telecommunications systems.

The ATS-19G-20-C1-R0 is an advanced model that comes with a variety of features that make it ideal for use in high-powered systems. It offers a large surface area to dissipate heat quickly, and its special design helps to extend heat dissipation even further. The device is corrosion-resistant and designed to work in tough and dusty environments, and its adjustable mounting system allows for easy installation. The ATS-19G-20-C1-R0 is also designed to be stackable, allowing for multiple heat sinks to be placed in the same enclosure for increased cooling performance.

The ATS-19G-20-C1-R0 is ideal for use in any application where high levels of heat dissipation are required. It is suitable for cooling high-powered electrical and electronic systems, and its high performance and adjustable mounting system make it a great choice for a variety of applications. With the ability to dissipate large amounts of heat quickly and efficiently, the ATS-19G-20-C1-R0 is an excellent choice for cooling large-scale and high-power systems.

The specific data is subject to PDF, and the above content is for reference

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