ATS-19G-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are essential components in many electronic devices as they help dissipate heat generated by components like transistors and processors. The ATS-19G-20-C3-R0 heat sink is a thermoelectric device that operates by taking advantage of the Peltier effect to cool or heat items through thermal conduction. In this article, we\'ll take a closer look at the ATS-19G-20-C3-R0 and its applications and working principle.

Application Field

The ATS-19G-20-C3-R0 is designed to transfer thermal energy between two objects while keeping them isolated from each other. It is most commonly used to transfer the heat generated by computers and other electronic devices. This it does by dissipating heat through the metal fins of the heat sink to the surrounding environment. This helps keep the device from overheating and allows increased performance because there is less temperature-related stress placed on the components.Other applications of the ATS-19G-20-C3-R0 heat sink include using them to cool electrical components in microscopes or other optical equipment, as well as data center applications. It can also be used with ultrasound devices and other sensitive equipment that require precise cooling.

Working Principle

When current is applied to the ATS-19G-20-C3-R0, the semiconductor material within it produces a temperature gradient between its two faces. This is known as the Peltier effect. The heat delivered by the current is dissipated into the surrounding environment by the aluminum fins of the heatsink, and the temperature differential between the two faces is maintained as a result.This example of thermal conduction is applied to the electrical components within a device like a computer. The heat produced by the components is transferred through the heat sink and dissipated into the surrounding environment. This kind of thermal conduction is much more efficient than other methods like air cooling, as it can cool objects faster and more evenly.

Conclusion

In conclusion, the ATS-19G-20-C3-R0 is a thermal - heat sink designed to transfer thermal energy between two objects while keeping them insulated from each other. It works by taking advantage of the Peltier effect to dissipate heat generated by electronic devices into the surrounding environment. The ATS-19G-20-C3-R0 can be used for various applications such as cooling electronic components in microscopes or other optical equipment, data centers, and ultrasound devices. By taking advantage of this thermoelectric technology, manufacturers can ensure these components are cooled safely and efficiently.

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