
Allicdata Part #: | ATS-19G-32-C2-R0-ND |
Manufacturer Part#: |
ATS-19G-32-C2-R0 |
Price: | $ 5.81 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 5.22837 |
30 +: | $ 4.93773 |
50 +: | $ 4.64726 |
100 +: | $ 4.35683 |
250 +: | $ 4.06637 |
500 +: | $ 3.77592 |
1000 +: | $ 3.70330 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.280" (57.90mm) |
Width: | 1.450" (36.83mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Description: The ATS-19G-32-C2-R0 is a thermal-heat sink specifically designed for applications in which maximum heat dissipation is required. This device is built with an efficient heat dissipation system, which ensures superior thermal performance and optimal reliability.
Application Field: The ATS-19G-32-C2-R0 thermal-heat sink offers a wide range of applications, as it is suitable for high power processors, power supplies, and other electronics that require optimum heat dissipation.
Working Principle: The ATS-19G-32-C2-R0 is designed using a patented technology which provides efficient heat dissipation. The advanced heat sink design has been optimized to operate with the smallest possible emphasis off the surface of the CPU or component in order to ensure optimum heat dissipation.
The ATS-19G-32-C2-R0 thermal-heat sink is made of a robust aluminum alloy that is resistant to deformation and can withstand extremely high temperatures. This device uses advanced finning technology, which significantly increases its heat dissipation efficiency and ensures that the thermal-heat sink will operate at peak performance.
The device also features an integrated fan that can boost airflow and provide even greater heat dissipation efficiency. This feature allows the device to maintain optimal performance and ensure long-term reliability.
Conclusion: The ATS-19G-32-C2-R0 thermal-heat sink is an excellent choice for applications in which maximum heat dissipation is required. With its advanced technology, efficient heat dissipation system, robust construction, and integrated fan, this device provides superior thermal performance and optimal reliability.
The specific data is subject to PDF, and the above content is for reference