ATS-19G-64-C2-R0

Heat sinks are essential components in a variety of industrial and consumer electronics for both cooling applications and for efficient power transmission. The Thermal - Heat Sinks market is continually growing as more and more applications call for thermal management solutions. ATS-19G-64-C2-R0 is a thermal - heat sink solution developed specifically for the applications of electronic, retail, industrial, military and aerospace markets. This thermal component is specifically designed to dissipate heat and protect electronics from elevated temperatures.

The ATS-19G-64-C2-R0 is a high-performance thermal management component designed to provide improved thermal performance and improved protection of electronics from elevated temperatures. This device combines a copper base plate, aluminum surface plate, and unique aluminum fin design providing optimal cooling performance for a wide variety of applications. The fin design consists of an anodized aluminum sheet with eight high-performance heat sink fins. The copper base plate provides superior thermal conductivity and durability, as well as providing a large surface area for effective heat transfer. Together, the materials and design of ATS-19G-64-C2-R0 provide superior temperature management.

The working principle of ATS-19G-64-C2-R0 is to transfer heat away from the electronic device by passive convection. As mentioned previously, the thermal component utilizes a copper base plate, aluminum surface plate, and aluminum fins. Heat generated during operation is conducted from the integrated circuit dies to the copper base plate. From there, the heat is passively convected through the fins to the aluminum surface plate, and dissipates into the surrounding environment.

ATS-19G-64-C2-R0 is designed for a variety of applications in the industrial, consumer, medical, military, and aerospace markets. In the industrial sector, this thermal component can be used for cooling electronic components, such as CPUs, GPUs, FPGAs, ASICs, memory modules, and power modules. In the consumer electronics market, this thermal component can be used for cooling PCs, laptops, tablets, and smartphones. Additionally, this thermal component can be used for maintaining optimal temperatures in medical equipment, military equipment, and aerospace systems.

The ATS-19G-64-C2-R0 provides improved thermal performance and improved protection of electronics from elevated temperatures. As a result, this thermal component is ideal for use in a variety of markets, including industrial, consumer, medical, military, and aerospace. By combining a copper base plate, aluminum surface plate, and aluminum fin design, this thermal component provides superior temperature management while being cost effective. ATS-19G-64-C2-R0 is a reliable and durable thermal management solution that can be used in a variety of applications.