| Allicdata Part #: | ATS-19G-65-C1-R0-ND |
| Manufacturer Part#: |
ATS-19G-65-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19G-65-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19G-65-C1-R0 Thermal-Heat Sink module is an essential piece of hardware for cooling and power control systems in electronic applications. It is a powerful and reliable thermal-heat sink, designed for use in large computer systems and in small embedded systems. It is designed to dissipate heat generated by a variety of electronic components, such as processors, graphic cards, and other devices.
The ATS-19G-65-C1-R0 thermal-heat sink features a compact design with a high surface area to volume ratio, allowing for efficient heat dissipation. This makes it suitable for use in devices with high concentrations of electronic components, such as high-end computer systems, servers, and other embedded systems. It also features surface mountable heat sinks that provide improved thermal performance compared to traditional HEAT SINK designs.
Since the ATS-19G-65-C1-R0 is designed for use in a variety of applications, it has a number of features that make it suitable for a wide range of applications. It features a low profile design, allowing for easy installation in tight spaces. The heat sink is also highly resistant to corrosion, which makes it ideal for use in harsh environments. Furthermore, the heat sink is made from a high-performance plastic material, providing superior thermal performance.
The ATS-19G-65-C1-R0 thermal-heat sink is designed for use in both high-end and low-cost applications. It is designed for low-voltage applications with a maximum operating temperature of 65 C (149 F). It also supports a wide range of power requirements, up to 135 watts. With its high thermal performance and low-cost design, it is ideal for use in a variety of electronic applications.
The ATS-19G-65-C1-R0 thermal-heat sink comes with a standard mounting hardware, including screws and brackets, and is available in two models: the ATS-19G-65-C1-R0 and the ATS-19G-65-C1-R1. The ATS-19G-65-C1-R0 is designed for use in high-end applications, where thermal performance and reliability are important, while the ATS-19G-65-C1-R1 is designed for use in low-cost applications, such as laptop and compact PC systems.
The working principle of the ATS-19G-65-C1-R0 Thermal Heat Sink is quite simple. A metal base at the bottom of the unit is heated by the electronic components, transferring the heat up through the metal fins to the top of the device. The heat is then dissipated to the surrounding air by convection. The metal fins have many small openings in them that increase the area of heat transfer, allowing for efficient dissipation of the heat.
The ATS-19G-65-C1-R0 Thermal Heat Sink is an efficient and reliable thermal-heat sink, designed for use in a wide range of electronic applications. It is designed for use in high-end and low-cost applications and supports a wide range of power requirements. Its compact design, corrosion resistance, and low profile make it ideal for use in tight and harsh environments. With its high thermal performance and low-cost design, it is the perfect choice for cooling and power controlling applications in any device.
The specific data is subject to PDF, and the above content is for reference