| Allicdata Part #: | ATS32506-ND |
| Manufacturer Part#: |
ATS-19G-67-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19G-67-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
The ATS-19G-67-C2-R0 is a thermal heat sink. It is designed to disperse heat from hot components that require an external cooling solution. This particular model is designed to be used on components that can withstand temperatures of up to 120°C. Since this device ensures an even temperature across the component, it is often used in electronic devices, particularly for active components such as computer CPUs.
Design
The ATS-19G-67-C2-R0 is constructed from high quality aluminum and zinc material. This material is lightweight and highly conductive, meaning that it can effectively dissipate heat away from the component. The heat sink design is in the form of a finned heat sink, which helps to increase the surface area exposed to the heat in the air. This increases the rate of heat transfer, and as a result, helps to cool the component even more. The fins are designed to be close together to increase the surface area, and to make the most of the amount of air passing over the fins.
Installation and Operation
The ATS-19G-67-C2-R0 can be installed by performing the following steps:
- Secure the heat sink onto the component using the appropriate mounting system.
- Seal any gaps between the component and the heat sink with an appropriate thermal paste or pad.
- Attach the necessary power supply and controls if required.
- Connect the fan to an appropriate power source.
Conclusion
The ATS-19G-67-C2-R0 is a thermal heat sink designed to cool components that can withstand temperatures of up to 120°C. Its construction from aluminum and zinc makes it lightweight and highly conductive. The finned design helps to increase the surface area, which makes the device more effective. The device is easy to install and use, and is an ideal cooling solution for electronic components.
The specific data is subject to PDF, and the above content is for reference