ATS-19H-116-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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• Introduction

The ATS-19H-116-C3-R0 is a thermal – heat sinks device designed to manage and transfer heat from high-powered applications effectively and efficiently. Heat sinks like the ATS-19H-116-C3-R0 are essential components in managing heat dissipation from high-powered devices such as processors, graphics cards, memory chip, and other high-power components. Heat-sink devices like the ATS-19H-116-C3-R0 are also essential in protecting these components against temperatures that are excessively high and can lead to device failure and depreciation.

• Application Field of the ATS-19H-116-C3-R0

The ATS-19H-116-C3-R0 is designed for use in a wide range of application fields, including:

• Computer and laptop processors
• Gaming and virtual reality systems
• Aerospace and automotive industries
• Oil and gas industries
• Medical and pharmaceutical industries

The ATS-19H-116-C3-R0 can also be used in other high-performance applications, such as:

• Semiconductor manufacturing
• Military and defense applications
• Laser and ultrafast laser technology applications
• Robotics and automation applications

• Working Principle of the ATS-19H-116-C3-R0

The ATS-19H-116-C3-R0 functions by transferring heat from a controlled source to a less controlled area. This process may be best explained using the analogy of a car engine. An internal combustion engine produces heat energy during the combustion process. This heat energy needs to be moved away from the engine in order to prevent the engine components from becoming too hot, which would cause failure and damage. So the engine is designed to have a heat sink – in this case, the ATS-19H-116-C3-R0 – that will transfer the heat away from the engine and into the car’s exhaust system.The ATS-19H-116-C3-R0 works on a similar principle. It utilizes a fan mounted to a base plate, with two frames to act as a heatsink. The fan transfers hot air away from the device and into the medium. Convection cooling is also used to transfer heat away from the device and into the medium. Heat is then dispersed through the medium, usually the air or a liquid coolant.For maximum efficiency, the ATS-19H-116-C3-R0 is designed to adhere tightly to the surface of the device it is protecting. This tight adhesion ensures that the heat is more efficiently transferred away from the device and into the medium, significantly reducing temperatures of the protected device and improving its performance.

• Conclusion

The ATS-19H-116-C3-R0 is a thermal – heat sinks device designed to manage and transfer heat from high-powered applications effectively and efficiently. Heat sinks like the ATS-19H-116-C3-R0 are essential components in managing heat dissipation from high-powered devices such as processors, graphics cards, memory chip, and other high-power components. The ATS-19H-116-C3-R0 functions by transferring heat from a controlled source to a less controlled area. It utilizes a fan mounted to a base plate, with two frames to act as a heatsink. The fan transfers hot air away from the device and into the medium. Convection cooling is also used to transfer heat away from the device and into the medium. The ATS-19H-116-C3-R0 can be used in a wide variety of high-performance applications, and its tight adhesion to the surface of the device ensures maximum heat transfer efficiency.

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