ATS-19H-120-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.57°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-19H-120-C3-R0 is a thermal heat sink. It is used for dissipating heat in many types of computer and electronic applications. The device is designed to maximize thermal dissipation of heat from components or otherwise reduce the environmental temperature of the system. The device works by conduction, convection and radiation to transfer the heat from the component to the external environment.

Application Field

ATS-19H-120-C3-R0 is mainly used for cooling CPU, GPU, memory, and other sensitive components in computer systems. It is also used for providing cooling in control systems, laboratory equipment, batteries and LED lighting. The device is designed to reduce the temperature of the system by efficiently conducting and convecting heat with its metallic fins.

Structure of Heat Sink

ATS-19H-120-C3-R0 consists of a metal fin base, a heat pipe, and a number of heat radiators. The metal fin base is a solid conducting plate which is made of aluminum or copper. It is responsible for transferring the heat from the component to the heat pipe and radiators. The copper heat pipes are small copper tubes which work to transfer the heat from the fin base to the external environment. The radiators are small sheet metal plates or cooled fins which are responsible for dissipating the heat from the heat pipe.

Working Principle

The working principle of ATS-19H-120-C3-R0 is quite simple. Heat is generated within the component due to electric currents passing through it. The heat is conducted through the metal fin base to the heat pipes. The heat is then conveyed through the heat pipes to the external environment while simultaneously radiating outwards in a 360 degree circumference. The heat is eventually dissipated into the air. This process helps in cooling the component and reducing the system temperature.

Features

ATS-19H-120-C3-R0 possesses several features, such as:

• High thermal efficiency: The device is designed to maximize the transfer of heat from the component to the external environment.
• Low weight and compact size: The device is small and lightweight, allowing it to be placed in tight space saving installation locations.
• Durable: The device is made of durable metal alloys, making it able to withstand high temperatures.
• Efficient heat transfer: The device works by conduction, convection and radiation to efficiently transfer the heat from the component to the external environment.
• Low sound levels: The device operates at low sound levels during operation, making it suitable for noise sensitive applications.

Conclusion

ATS-19H-120-C3-R0 is a thermal heat sink used for cooling computer and electronic components. It works by conduction, convection and radiation to efficiently transfer the heat from the component to the external environment. It is lightweight and compact in size, making it suitable for tight space saving installations. The device is made of durable metal alloys, allowing it to withstand high temperatures. It is also capable of operating at low sound levels, making it suitable for noise sensitive applications.

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