| Allicdata Part #: | ATS32641-ND |
| Manufacturer Part#: |
ATS-19H-184-C2-R0 |
| Price: | $ 4.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19H-184-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.03200 |
| 10 +: | $ 3.92112 |
| 25 +: | $ 3.70339 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an integral part of any electronic system, playing the vital role of dissipating heat away from critical components and thereby preventing damage resulting from overheating. In order to ensure that their heat sink is fit for purpose, thermal design engineers must select an appropriate heat sink for their desired application, taking into consideration its form factor, thermal characteristics and performance.
The ATS-19H series, from koolance, is a range of efficient heat sinks made from extruded aluminium and stainless steel. The most commonly used model is the ATS-19H-184-C2-R0, a pin-fin heat sink with an effective cooling capacity of 184W. Its thermal performance is further enhanced by the use of silicone thermal gap pads with a thermal conductivity of 4.9 W/mK.
Application field
The ATS-19H-184-C2-R0 is well suited for a range of applications where effective and efficient thermal management is required. These include Computers, PCs, peripherals, Domestic appliances, LED Lighting, and Automotive systems. It is suitable for cooling components such as ICs, transistors, FPGAs and Heat Pipes. Due to its slender profile, it is also suitable for applications where space is limited.
Working principle
The ATS-19H-184-C2-R0 works on the principle of increasing the surface area in order to dissipate heat. It achieves this by having a large number of tiny fins on its surface that increase the effective area through which heat can be transferred from the device to the air. The fins are arranged in an efficient configuration, and the airflow is directed around the heat sink, allowing for efficient heat transfer.
The heat sink also utilises a combination of thermal convection and conductive heat transfer to transfer heat. Thermal convection occurs when air is heated and rises, carrying the heat away with it. This is augmented by the use of the silicone thermal gap pads, which enable the heat sink to better transfer heat from the device to the fins. The fins then dissipate the heat into the surrounding air.
The ATS-19H-184-C2-R0 is a highly efficient heat sink, making it a suitable choice for a variety of thermal management applications. Its low profile and efficient thermal characteristics make it an ideal choice for those needing to maximize space, but still requiring effective thermal management.
The specific data is subject to PDF, and the above content is for reference