| Allicdata Part #: | ATS-19H-191-C3-R0-ND |
| Manufacturer Part#: |
ATS-19H-191-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19H-191-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19H-191-C3-R0 is a thermal-heat sink made specifically for cooling electronic components and preventing them from overheating. It works by dissipating the heat from the components by transferring it from the component into the air surrounding it. The heat sink features a series of fins that help to extend the surface area of the heat sink so that as much heat as possible can be transferred to the air. The heat is then dissipated into the surrounding environment instead of the interior of the component.
The ATS-19H-191-C3-R0 is commonly used in electrical and electronic circuits, and is designed primarily for use in applications which include high levels of current draw. This is because the heat generated by high-current circuits can build up quickly, and the heat sink allows for the heat to be dissipated quickly and efficiently.
The ATS-19H-191-C3-R0 is also suitable for cooling any electronic components that generate a large amount of heat, as it is able to absorb and dissipate the heat effectively. It is also effective at cooling several components at the same time, as its fins increase the surface area for additional cooling. This makes it ideal for use in complex electronic systems which require several cooling components.
The ATS-19H-191-C3-R0 is designed to be very efficient at cooling electronics, and its design is much more effective than using fans or other conventional cooling methods. This is due to the fact that fans can only push the heat away from the component, but can not dissipate the heat. The ATS-19H-191-C3-R0, on the other hand, is designed to be able to absorb and dissipate the heat from the component, and with its increased surface area the heat can be quickly and efficiently dissipated.
The ATS-19H-191-C3-R0 is also very durable and can maintain its performance over a long period of time. This helps to ensure that the heat sink stays effective at cooling electronics for extended periods of time, reducing the need to replace it. The ATS-19H-191-C3-R0 is also available in a range of sizes and can be easily adapted to fit the needs of any particular system.
Overall, the ATS-19H-191-C3-R0 thermal-heat sink is a very effective and reliable cooling mechanism for many electronic components. Its design allows for efficient absorption of heat and its fins allow for quick dissipation, meaning that the components do not overheat and can work consistently for long periods of time. The unit is also highly durable, and its range of sizes allow it to fit almost any application.
The specific data is subject to PDF, and the above content is for reference