ATS-19H-20-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Thermal heat sinks are devices that are used to dissipate heat energy from electronic components such as processors and power supplies. Heat sinks are designed to facilitate the dissipation of heat from electronic components by increasing the surface area for air circulation. Heat sinks are often constructed using materials such as aluminum, copper, and other materials that are capable of dissipating heat quickly.The ATS-19H-20-C2-R0 is an example of a thermal heat sink. It is designed to be used with a variety of electronic components, including processors, power supplies, and other types of electronic components that may require additional thermal dissipation. This heat sink is constructed using aluminum and copper, and the design features a type of finned construction that further increases the surface area for better air circulation and heat dissipation.The ATS-19H-20-C2-R0 provides excellent thermal performance for the electronic components that require it. Its efficient and effective design allows for a higher rate of exchange between the hardware and the air circulation in the enclosure, increasing the rate of heat dissipation from the component. This means that the component stays within a manageable temperature range even when operating in a high-power environment.This heat sink is also designed with an airflow frame that helps to improve the overall heat dissipation. The airflow frame has multiple air inlet and outlet ports which enable air to flow in and out of the enclosure efficiently. This ensures that the component is kept at a manageable temperature even when running at high power. Additionally, the airflow frame helps to reduce noise levels, making it an ideal choice for applications that require silent operation.The ATS-19H-20-C2-R0 is also highly effective at managing heat dissipation. Its aluminum and copper construction ensures that the heat is dissipated effectively, keeping the component within a safe temperature range. Additionally, the finned construction of the heat sink increases the overall surface area, providing superior airflow and heat dissipation. This makes it ideal for applications that require continuous, reliable thermal management.Overall, the ATS-19H-20-C2-R0 is an excellent choice for applications that require efficient and reliable thermal management. Its aluminum and copper construction allows for an efficient heat transfer and its finned design increases the surface area, providing superior cooling performance. Additionally, its airflow frame helps to improve airflow and reduce noise levels, making it ideal for silent operation. This combination of features makes it an ideal choice for a variety of electronic components in various applications.

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