
Allicdata Part #: | ATS-19H-20-C3-R0-ND |
Manufacturer Part#: |
ATS-19H-20-C3-R0 |
Price: | $ 4.67 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.19895 |
30 +: | $ 3.96543 |
50 +: | $ 3.73225 |
100 +: | $ 3.49896 |
250 +: | $ 3.26570 |
500 +: | $ 3.03243 |
1000 +: | $ 2.97412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are well known for their use in a variety of electronic appliances in the consumer market. The ATS-19H-20-C3-R0 heat sink is a low cost alternative to other thermal solutions. The sink is designed for moderate intensive applications in which the rate of heat dissipation is relatively low.
The ATS-19H-20-C3-R0 is made from aluminum alloy, which offers excellent heat transfer characteristics. It has a large heatsink body measuring 19 x 20 mm and a lower-cost thermal design than other similar models. The sink has an integrated thermal pad which helps evenly spread the heat across its surface.
The ATS-19H-20-C3-R0 thermal design has a fanless, open-air-capable design. Its lower noise and vibration makes it ideal for silent, low-power applications. For this reason, the sink is suitable for applications such as low-power CPUs and GPUs. In addition, it is also great for cooling LED lights, ATMs and low-power computing.
The ATS-19H-20-C3-R0 uses a patent-pending heatpipe that ensures uniform and efficient cooling across the entire body. The use of this heatpipe also eliminates the need for plates, spacers, thermal paste, or adhesives. Designed for use with 7.7W and less at 115 degrees Celsius, the heatpipe allows for a reliable thermal connection to the device.
The ATS-19H-20-C3-R0 offers several advantages for different applications. Its low-cost and lack of power requirements make it ideal for making low-power computing and storage devices. Its fanless design and open-air design make it suitable for silent operations and low vibration. Furthermore, its low noise production and vibration make it a great choice for cooling electronic appliances. It is also a great choice for cooling LED lights, ATMs, and many other low-power devices.
In conclusion, the ATS-19H-20-C3-R0 provides ample performance and efficiency for a variety of applications, such as low-power CPUs and GPUs, LED lights, ATMs, and many other low-power computing applications. With its low-cost and reliable design, the ATS-19H-20-C3-R0 is an excellent alternative to more costly thermal solutions. It offers incredible performance, efficiency, noise production, and vibration for its size, making it a great choice for many different applications.
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