| Allicdata Part #: | ATS32659-ND |
| Manufacturer Part#: |
ATS-19H-200-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19H-200-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47004 |
| 25 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have been expanding their use in many applications due to their ability to disperse and manage heat away from delicate integrated circuits and components. One of the most advanced heat sink products on the market today is ATS-19H-200-C2-R0. This advanced thermal management system incorporates both an innovative air-cooled and water-cooled design, enabling it to rapidly discharge heat and maintain the ideal operating temperatures for use in even the most demanding applications.
ATS-19H-200-C2-R0 is one of the most advanced heat sinks available on the market today, providing a wide range of applications in electronics cooling. This heat sink is designed with an advanced fin array to ensure efficient and effective dispersion of heat from components, helping them to remain within the correct operating temperature ranges. The use of an innovative fan design ensures that a steady flow of air is consistently circulated through the fins, ensuring that the ideal temperature control is maintained at all times.
As the name suggests, ATS-19H-200-C2-R0 also has the ability to be water-cooled as well as air-cooled. By connecting a water-cooling unit to the heat sink, hot components can be dissipated quickly and precisely to ensure that safe operating temperatures are maintained. This means that the heat sink can be used in many applications where air-cooling alone is inadequate, such as in areas with increased levels of ambient heat.
The application field for the ATS-19H-200-C2-R0 heat sink is diverse and includes many areas of electronics cooling, such as medical devices, automotive, datacenter, and industrial automation. This heat sink is a great choice for these applications due to its efficient cooling of components, fast heat dissipation, and precision thermal management. Medical device cooling is especially critical, as these devices require precise operating temperatures in order to work safely and effectively.
The ATS-19H-200-C2-R0 also has other features that make it an ideal choice for cooling applications. It\'s designed with a pre-installed fan that is configurable, meaning the user can adjust the fan speeds to provide the most efficient cooling settings for their application. This heat sink is also designed to be low profile, making it easy to fit in smaller devices and tight spaces. Finally, its lightweight design ensures that it won\'t add any unnecessary weight to devices, making it perfect for a range of thermal management needs.
In conclusion, the ATS-19H-200-C2-R0 is an advanced thermal management solution that offers a wide range of benefits for use in cooling applications in a variety of applications. With its air-cooled and water-cooled capabilities, as well as its low profile design and configurable fan speed, this heat sink can provide a reliable source of cooling for long periods of time in even the most demanding environments. With its wide range of features and benefits, the ATS-19H-200-C2-R0 is the perfect choice for many thermal management needs.
The specific data is subject to PDF, and the above content is for reference