| Allicdata Part #: | ATS-19H-23-C3-R0-ND |
| Manufacturer Part#: |
ATS-19H-23-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19H-23-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to the performance of any electronic system. Heat sinks can effectively dissipate heat from electronic components, providing an essential role in keeping the operating temperature of a system within ideal ranges. ATS-19H-23-C3-R0 is one of the widely used heat sink designs that can be found in many different applications. This article will discuss the applications of ATS-19H-23-C3-R0 as well as its working principle.
ATS-19H-23-C3-R0 is a thermal management device that is designed to provide enhanced cooling performance. It is a compact design that features two plates that are connected by two heat pipes. This type of heat sink is typically used in applications that require a more efficient heat dissipation than more traditional box fin type heat sinks. It is also a popular choice for use in smaller form factor applications where space is at a premium.
One of the most common applications of ATS-19H-23-C3-R0 is in industrial computing. In these instances, high performance processors are used in server or workstation machines that require the best performance and stability. The ATS-19H-23-C3-R0 can dissipate heat effectively, allowing the processor to remain within its safe temperature operation range. It is also capable of providing additional cooling to other components in the system such as memory modules and hard drives. Additionally, the ATS-19H-23-C3-R0 can be used in the automotive sector for cooling engines and other components.
The working principle of ATS-19H-23-C3-R0 is relatively straightforward. Heat is transferred from the heat source to the heat sink through a thermal conductive medium. This can be either a metal, a liquid, or a combination of both. Once the heat is transferred, it is dissipated away from the heat source into the ambient environment with the help of cooling fans or other cooling devices. The heat sink itself uses a combination of high thermal conductivity materials and a special heat dissipation fin design to increase the rate of heat transfer.
The ATS-19H-23-C3-R0 is a versatile and reliable heat sink designed for a variety of applications. Its efficient heat dissipation properties make it a popular choice for industrial computing and automotive applications that require high performance cooling. Furthermore, its design is straightforward and the working principle of the heat sink is easy to understand. Therefore, the ATS-19H-23-C3-R0 is an excellent thermal management solution for a wide range of applications.
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