| Allicdata Part #: | ATS32716-ND |
| Manufacturer Part#: |
ATS-19H-79-C2-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19H-79-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.32010 |
| 10 +: | $ 3.23379 |
| 25 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important element in many industries, including electronics, automotive and medical. There are several ways to manage heat within a system, such as thermoelectric cooling, fan-based cooling systems, and heat sinks. Heat sinks are gaining more and more popularity in electronic systems due to their low cost, high efficiency, and ability to be used in tight spaces with minimal noise emissions. The ATS-19H-79-C2-R0 is one of the latest developments in heat sink technology.
The ATS-19H-79-C2-R0 is a high-performance, low-profile, and maintenance-free heat sink designed for embedded desktop applications. With its modular design, the ATS-19H-79-C2-R0 supports a wide range of CPUs and ambient temperatures. The fanless design significantly reduces noise output, and the internal copper heat sink ensures a low thermal resistance. Additional features include a built-in integrated temperature sensor and an adjustable fan speed controller.
An important factor to consider when selecting a heat sink is its ability to effectively dissipate heat. The ATS-19H-79-C2-R0 has an array of fins and an optimized fan that generate a high airflow, allowing maximum heat dissipation. Additionally, the ATS-19H-79-C2-R0\'s fanless design further reduces noise levels in the system. The ATS-19H-79-C2-R0 has been tested to effectively and efficiently dissipate heat up to 160 Watts, allowing the CPU to run at its optimal performance.
The ATS-19H-79-C2-R0 is designed with a specific set of principles and applications in mind. First of all, its small size, low-profile design, and maintenance-free features make it ideal for embedded desktop applications. Additionally, its low thermal resistance, noise reduction, and wide range of CPUs are well suited for a variety of consumer electronics, such as computers, laptops, servers, and cell phones. The ATS-19H-79-C2-R0 is also used in medical and industrial devices, including medical diagnostic equipment, vending machines, and GPS navigation systems.
The ATS-19H-79-C2-R0 is based on a two-stage heat-sinking principle. In the first stage, the air, either natural or forced, flows through high-efficiency heat sinks on the outer surface of the CPU case, cooling the CPU itself. In the second stage, the air flows through an array of fins and the adjustable fan speed controller in the ATS-19H-79-C2-R0\'s internal copper heat sink. This ensures a thermal resistance of 0.09°C/W or less for additional heat dissipation.
The ATS-19H-79-C2-R0 is an innovative heat sink and an ideal solution for applications requiring efficient and silent thermal management. With its high performance, low-profile design, wide range of CPUs support, and adjustable fan speeds, the ATS-19H-79-C2-R0 has the flexibility and efficiency needed for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference