| Allicdata Part #: | ATS-19H-85-C3-R0-ND |
| Manufacturer Part#: |
ATS-19H-85-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19H-85-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of many industrial and consumer electronics, and the proper cooling of components is often essential for optimal performance. Heat sinks are devices used to dissipate heat from an object. Heat sinks typically provide increased surface area or air circulation to help remove heat from the object. ATS-19H-85-C3-R0 is a heat sink designed specifically for thermal management of components in industrial and consumer electronics.
The ATS-19H-85-C3-R0 is a highly efficient heat sink that provides up to 85 percent thermal dissipation in low power applications. The device is equipped with a removable fan assembly that allows for easy adjustment of the heat sink for optimal performance. The fan assembly also helps to increase the air circulation and heat dissipation capacity of the device.
The ATS-19H-85-C3-R0 is designed for applications with low power and temperature requirements. It is ideal for applications such as LED lighting, processors, screens, routers, and other low power electronic devices. The device is also suitable for use in consumer electronics such as laptops, TVs, and game consoles.
The ATS-19H-85-C3-R0 is engineered with a finned structure to maximize the air circulation, allowing for an efficient air cooling system. The heat sink consists of a die cut aluminum fin with an embedded heat spreader and contact plate. The contact plate helps to improve the heat transfer from the heat source to the heat sink, allowing for efficient cooling. Furthermore, the contact plate maintains the electrical connection between the heat source and the heat sink.
In addition, the ATS-19H-85-C3-R0 also features a high-performance heat sink material, which helps reduce thermal dissipation and improve heat transfer. The material is designed with superior thermal conductivity that helps improve heat transfer from the object to be cooled. The material also features a thin profile to minimize the overall size of the heat sink.
The ATS-19H-85-C3-R0 is a reliable and efficient heat sink that is designed for use in low power applications. It is engineered with a finned structure and contact plate to maximize air circulation and thermal dissipation, while also featuring a high-performance heat sink material to help reduce thermal dissipation and improve heat transfer. As such, it is a perfect solution for applications such as LED lighting, processors, screens, routers, and consumer electronics.
The specific data is subject to PDF, and the above content is for reference