| Allicdata Part #: | ATS32758-ND |
| Manufacturer Part#: |
ATS-20A-110-C2-R1 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20A-110-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.07780 |
| 10 +: | $ 4.93920 |
| 25 +: | $ 4.66452 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a device designed to dissipate heat generated by a variety of electrical components. The ATS-20A-110-C2-R1 heat sink is a medium-sized heat sink designed for cooling applications in a variety of electronic devices. Designed with an overall length of 1.18" (30 mm) and a width of 1.17" (30 mm), the ATS-20A-110-C2-R1 can dissipate heat for higher power components at a superior level of thermal efficiency. The heat sink has an impedance rating of 3.9 (± 0.6)Ω/W (dependent on mounting impedance, thermal grease and mounting screws) and can handle power up to 20 Watts in a very small package.
The heat sink is designed to interface with TO-220, TO-264, Power package, PTH package, Tab, and SMS packages, making it suitable for a variety of devices. It features a two-stage aluminum fin construction that allows it to draw heat away from the source quickly and efficiently. The ATS-20A-110-C2-R1 also features aviation-grade mounting screws and sinks to ensure secure and reliable super-fast thermal heat exchange. Additionally, it offers high-temperature silicone seals and a large-area contact surface that helps to secure the heat sources and improves heat conduction. All these features make the ATS-20A-110-C2-R1 the ideal solution for heat dissipation in a variety of devices.
The ATS-20A-110-C2-R1 is designed for applications where fast thermal transfer is required. It can dissipate up to 20 Watts of power at temperatures ranging from -40°C to +85°C (dependent on mounting pads). It is suitable for use with devices that require high-temperature operation and is able to maintain a low profile while still providing superior thermal efficiency. It is also designed with a special “pin-in-fin” technique that utilizes pins within the fins to increase heat dissipation without sacrificing power. This technique increases the heat dissipation area, which in turn reduces thermal resistance and improves overall performance.
The ATS-20A-110-C2-R1 is the perfect choice for cooling applications in a variety of electronic devices. It is designed to offer superior performance and reliability in harsh environments and can dissipate heat from components with a power rating of up to 20 Watts. Its combination of high temperature resistance, fast thermal transfer, and pin-in-fin technology makes it an ideal choice for cooling applications.
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